An inverter heat dissipation system based on semiconductor refrigeration

A heat dissipation system and semiconductor technology, applied in refrigerators, refrigeration and liquefaction, machines using electromagnetic/magnetic effects, etc., can solve problems such as increased machine weight, evaporator volume limitation, and overall machine volume increase.

Inactive Publication Date: 2011-12-28
孙建章 +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the traditional method of forced heat dissipation with a metal radiator and a fan is used, there are the following problems: (1) Due to the limited area of ​​the metal radiator, the heat dissipation effect is limited. If the area is increased, it will inevitably cause metal heat dissipation. The volume of the fan increases, which brings inconveniences such as an increase in the weight of the machine and an increase in the volume of the whole machine; (2) To improve the heat dissipation effect of the high-power fan, the only way is to increase the speed, which will easily lead to a decrease in reliability and make the inverter The life of the transformer is affected; (3) The above two points will cause the temperature inside the chassis to remain high. In this case, the selected components must be able to adapt to the high ambient temperature, resulting in increased costs
However, the heat dissipation effect of this structure is not only limited by the volume of the evaporator, but also affected by the temperature of the external environment. According to the principle of heat exchange, we know that heat is always transferred from places with high temperature to places with low temperature, and the temperature difference The larger the size, the faster the transfer speed. In this way, if the ambient temperature of the inverter is high (such as outdoors in summer), the heat will not be dissipated, thus greatly shortening the service life of the inverter.

Method used

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  • An inverter heat dissipation system based on semiconductor refrigeration
  • An inverter heat dissipation system based on semiconductor refrigeration
  • An inverter heat dissipation system based on semiconductor refrigeration

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Embodiment Construction

[0015] The technical solutions of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0016] Such as figure 1 As shown, the present invention provides an inverter heat dissipation system based on semiconductor refrigeration, including a semiconductor refrigerator 1, an intelligent controller 2, and a fan 3, wherein the heat-absorbing surface of the cold end of the semiconductor refrigerator 1 is closely connected to a high-power heating device. contact, and the heat dissipation surface of the hot end is provided with a fan 3, and the fan 3 is started under the control of the intelligent controller 2, thereby forcibly dissipating heat from the hot end of the semiconductor refrigerator 1.

[0017] Cooperate figure 2 As shown, it is a schematic diagram of the principle that semiconductors can realize cooling at one end and heating at the other end. N and P type semiconductors are arranged in pairs, and one end of each pair o...

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Abstract

The invention discloses an inverter heat dissipation system based on semiconductor refrigeration, which includes a semiconductor refrigerator, an intelligent controller and a fan. There is a fan, and the fan starts under the control of an intelligent controller. This kind of heat dissipation system can realize the heat dissipation of high-power heating devices, reduce the use conditions of components, prolong the service life of products, and is small in size and light in weight.

Description

technical field [0001] The invention relates to a structure of a photovoltaic inverter, in particular to a cooling system for cooling a high-power heating device of a photovoltaic inverter. Background technique [0002] The storage of electric energy has to solve many problems. The current common method is to connect photovoltaic power to the grid for power generation through inverters, and then take power from the grid when power is needed. One of the important issues is the conversion efficiency of the inverter during the power conversion process, and the loss of the inverter is dissipated in the form of heat. The heat generated by the loss of high-power heating devices in high-power inverters will greatly increase the cost of components, and at the same time greatly reduce the service life of components in the inverter. Therefore, how to solve the heat dissipation problem of the high-power inverter is a key issue to improve the service life of the inverter. [0003] ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02M1/00F25B21/02
Inventor 孙建章张福兴王伟
Owner 孙建章
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