Inductance coupling apparatus and plasma processing equipment applying same

A technology of inductive coupling and plasma, applied in the field of microelectronics, can solve problems such as chip pollution and consumption of built-in inductive coupling coils, and achieve the effect of avoiding consumption and chip pollution

Active Publication Date: 2013-03-27
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology

[0008] In order to solve the above problems, the present invention provides an inductive coupling device, which can effectively suppress the negative self-bias voltage on the built-in inductive coupling coil, thereby avoiding the problem of the built-in inductive coupling coil being consumed, and at the same time avoiding the Contamination of wafers

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  • Inductance coupling apparatus and plasma processing equipment applying same
  • Inductance coupling apparatus and plasma processing equipment applying same
  • Inductance coupling apparatus and plasma processing equipment applying same

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Embodiment Construction

[0029] The inductive coupling device provided by the present invention is mainly used for releasing radio frequency power in the process chamber of plasma processing equipment, so as to excite and maintain plasma. The inductive coupling device includes an inductive coupling coil arranged inside the process chamber, and a radio frequency power supply and a voltage regulation power supply connected to the inductive coupling coil. Wherein, the output end of the radio frequency power supply is connected to a matching device, and then connected to the two ends of the inductively coupled coil via the two output ends of the matching device. The output end of the voltage-regulating power supply can be connected to any end of the inductive coupling coil, which is used to load a positive bias voltage to the inductive coupling coil, thereby suppressing the negative self-bias of the inductive coupling coil. The voltage-regulating power supply can use a DC power supply or a DC pulse power ...

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Abstract

The invention provides an inductance coupling apparatus used for exciting and maintaining plasma in a technical cavity. The inductance coupling apparatus comprises an inductance coupling coil arranged in the technical cavity, a radio frequency power supply connecting with the inductance coupling coil and a voltage regulating power supply. In a technical process, the voltage regulating power supply loads positive bias to the inductance coupling coil to reduce even eliminate negative self-bias near the inductance coupling coil, problems that the inductance coupling coil is consumed in the technical process, wafer pollution is generated and the like are avoided. The invention also provides plasma processing equipment applying the above inductance coupling apparatus.

Description

technical field [0001] The invention relates to the technical field of microelectronics, in particular to an inductive coupling device and plasma processing equipment using the inductive coupling device. Background technique [0002] In the production process of semiconductor chips, solar cells, flat panel displays and other microelectronic products, processing processes such as plasma etching, plasma physical or chemical vapor deposition are required, and these processes need to be completed with the help of corresponding plasma processing equipment . At present, there are mainly the following types of plasma processing equipment: DC discharge type, capacitively coupled plasma (CCP) type, inductively coupled plasma (ICP) type, and electron cyclotron resonance plasma (ECR) type. Among them, the ICP device is widely used because it can obtain high-density plasma at a lower working pressure, and has the advantages of simple structure and low cost. [0003] see figure 1 , wh...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05H1/46C23C14/48C23C16/513
Inventor 韦刚
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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