Apparatus for producing Ic chip mounter

Abstract

Provided is an IC chip mounter production apparatus which can allow curing of an adhesive for a short time without requiring a large space for a heating and pressurizing mechanism for the adhesive to secure an IC chip on a film substrate, and rarely damages IC chips to increase the yield. The IC chip mounter production apparatus (1) is configured in a manner that a carrying passage for a film substrate (8) on which an antenna circuit (82) is formed and an IC chip (83) is mounted through an adhesive (84), is provided with a thermal compression part (5) wherein a cover sheet (85) is laid on the film substrate (8) to cover the same and the IC chip (83) is bonded on the film substrate (8) by thermal compression, and a cover sheet supply part (4); and the thermal compression part (5) comprises a belt (82) to hold the film substrate (8) mounted with the IC chip (83) between the belt and the cover sheet (85), a tensile force providing means (84a) to provide a tensile force to the cover sheet (85), and a heating means (86) to heat the film substrate (8).

Description

technical field [0001] The present invention relates to a manufacturing device of an IC chip package. Background technique [0002] In recent years, a wireless IC tag, which is a type of RFID (Radio Frequency Identification, radio frequency identification), has been used as a package on which an IC chip is mounted. Among IC tags, a tag called a passive electronic tag (Passive tag) has a structure that does not load a battery, and an IC chip with unique identification information and a small antenna circuit are pasted on a film substrate. The electric wave sent by the reader generates a small amount of power inside the circuit, and uses this power to communicate with the IC tag reader to read and write the information in the IC chip. As a non-contact IC card, it can be used in bus cards, electronic money, authentication cards, etc. widely used in the field. In addition, recently, an IC chip called an active tag (Active tag) that is equipped with a battery and emits radio wa...

AI Technical Summary

Problems solved by technology

[0007] However, in the manufacturing apparatus of the above-mentioned IC chip package, while continuously conveying the substrate or the film substrate, sticking the circuit chip, loading the IC chip, and performing thermocompression bonding in order to cure the adhesive, it is also necessary to For quite a long time, it is necessary to extend the total length of the heated and pressurized mechanism part, which requires a lot of space

In addition, the IC chip is a very fine (for example, less than 1 mm square) precision component, and its ability to withstand external pressure and impact is very weak. Therefore, it is considered that when the adhesive is cured, once the IC chip is subjected to excessive pressure, it will be damaged. The possibility of damage may lead to a decrease in the yield of the IC chip package

Moreover, it is also difficult to adjust the pressure to the extent that the IC chip will not be damaged

In view of the above-mentioned various reasons, in the conventional IC chip package manufacturing equipment, there will be waste in terms of time, cost, space, and yield.

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