Failure analysis method for PCB (Printed Circuit Board)

A PCB board, failure analysis technology, applied in the field of analysis, can solve problems such as failure, large error, PCB board impedance and resistance cracks, etc.

Inactive Publication Date: 2012-01-11
SHANGHAI FALAB TEST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] PCB boards often have failure phenomena due to abnormal impedance or cracks in the resistance between adjacent pins that are excluded. The existing failure analysis of PCB boards often uses optical microscopic observation of the appearance. This method can only initially detect the occurrence Failed computer motherboards have low precision and large errors

Method used

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Embodiment

[0014] A PCB board failure analysis method, it may further comprise the steps:

[0015] 1) Conduct an optical inspection of the appearance of the PCB board to determine whether it is contaminated or cracked;

[0016] 2), carry out electrical performance test on the PCB board judged to have pollution or cracking phenomenon in step 1), and judge whether it has electrical abnormality;

[0017] 3), carry out X-RAY ray detection to the PCB board judged to have electrical abnormality in step 2), judge whether the welding on it is good;

[0018] 4), carry out electron scanning microscope observation to the PCB board that judges to have welding abnormality in step 3);

[0019] 5), carry out energy spectrum analysis to the PCB board processed through step 4).

[0020] Wherein, the reasons for the failure of the PCB include thermal stress, mechanical stress and tidal stress.

[0021] The PCB board failure analysis method of the present invention can effectively and quickly detect the...

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PUM

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Abstract

The invention discloses a failure analysis method for a PCB (Printed Circuit Board). The failure analysis method comprises the steps of: (1) performing optical appearance inspection on the PCB to judge whether contamination or cracking phenomena exist in the PCB; (2) performing electrical performance detection on the PCB judged to be with the contamination or cracking phenomena in the step (1) to judge whether electrical abnormality exists in the PCB; (3) performing X-RAY detection on the PCB judged to undergo electrical abnormality in the step (2) to judge whether welding on the PCB is good or not; (4) performing electronic scanning microscope observation on the PCB judged to undergo welding abnormality in the step (3); and (5) performing energy spectrum analysis on the PCB treated in the step (4). According to the failure analysis method for the PCB in the invention, by performing the optical appearance inspection, the electrical performance detection, the X-RAY detection and the electronic scanning microscope observation on the PCB, the failure phenomenon of the PCB can be detected effectively and rapidly.

Description

technical field [0001] The invention relates to an analysis method, specifically a failure analysis method, especially a method for failure analysis of a PCB board. Background technique [0002] PCB boards often have failure phenomena due to abnormal impedance or cracks in the resistance between adjacent pins that are excluded. The existing failure analysis of PCB boards often uses optical microscopic observation of the appearance. This method can only initially detect the occurrence Failed computer motherboards have low precision and large errors. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a PCB board failure analysis method, which can accurately and effectively detect the failure phenomenon generated by the PCB board. [0004] In order to solve the above-mentioned technical problems, the present invention provides a kind of PCB board failure analysis method, and it comprises the following steps: [0005]...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N21/88G01R31/00G01N23/00G01N23/22
Inventor 刘学森
Owner SHANGHAI FALAB TEST
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