Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Device integrated with Schottky diode in power transistor and forming method thereof

A Schottky diode and power transistor technology, which is applied in the field of integrated Schottky diode devices and its formation, can solve the problem of small breakdown voltage, achieve the effect of reducing reverse electric field and improving source-drain breakdown voltage

Inactive Publication Date: 2012-01-18
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
View PDF3 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The problem to be solved by the present invention is to provide a method for forming a device integrating a Schottky diode in a power transistor, so as to solve the problem that the source-drain breakdown voltage of the existing power transistor is relatively small

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Device integrated with Schottky diode in power transistor and forming method thereof
  • Device integrated with Schottky diode in power transistor and forming method thereof
  • Device integrated with Schottky diode in power transistor and forming method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] It can be seen from the background art that, in the existing devices in which the Schottky diode is integrated in the power transistor, the source-drain breakdown voltage of the power transistor is relatively small. The inventors conducted research on the above problems and found that increasing the thickness of the oxide layer on the sidewall of the Schottky trench can reduce the reverse electric field of the power transistor under the condition of constant reverse voltage, thereby improving the power source of the power transistor. Drain breakdown voltage, improving the source-drain breakdown characteristics of power transistors.

[0036] After further research, the inventor provides, in an embodiment of the present invention, a device in which a Schottky diode is integrated in a power transistor and a forming method thereof, so as to improve the source-drain breakdown characteristics of the power transistor.

[0037] In order to make the above objects, features and a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a device integrated with a Schottky diode in a power transistor and a forming method thereof. The method comprises the following steps of: providing a semiconductor substrate, wherein the semiconductor substrate comprises a Schottky region and a transistor region, and a first n type epitaxial layer is formed on the surface of the semiconductor substrate; forming a Schottky groove positioned in the Schottky region within the first n type epitaxial layer; forming a first oxidation layer on the surface of the Schottky groove; forming a transistor groove positioned in the transistor region within the first n type epitaxial layer; forming a second oxidation layer on the surface of the transistor groove and the surface of the first oxidation layer; forming a polysilicon layer full of the Schottky region and the transistor region on the surface of the second oxidation layer; and forming a power transistor in the transistor region. According to the embodiment of the invention, source-drain breakdown voltage of the power transistor in the device integrated with the Schottky diode in the power transistor can be increased and the source-drain breakdown characteristic can be improved.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a device integrating a Schottky diode in a power transistor and a forming method thereof. Background technique [0002] With the continuous development of semiconductor technology, a power device (Power Device), as a new type of device, is widely used in fields such as disk drives and automotive electronics. Power devices need to be able to withstand large voltage, current and power loads. However, existing devices such as MOS transistors cannot meet the above requirements. Therefore, in order to meet the needs of applications, various power devices have become the focus of attention. [0003] In order to improve the cross-frequency characteristics of power devices, a common method at present is to connect a Schottky diode in parallel on the chip of the power transistor, that is, integrate a Schottky diode in the power transistor. A device integrated with a Schottky diode in a pow...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/329H01L21/336H01L29/872H01L29/78H01L29/861
Inventor 刘宪周
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products