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Large size mounting RFID upside-down mounting pasting method and apparatus thereof

A patch device and flip-chip technology, which is applied in the manufacture of antenna supports/mounting devices, electrical components, semiconductors/solid-state devices, etc., can solve problems such as inability to produce in small batches, improve work efficiency, and save time for proofing Effect

Inactive Publication Date: 2013-03-20
广东宝丽华服装有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it can only be used for experimental pattern making, but not for small batch production
Nowadays, the pure roll antenna production process cannot fully meet the needs of the market. Many special occasions, such as the production process of clothing thermal transfer labels, metal labels, etc., are not suitable for the roll production process.

Method used

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  • Large size mounting RFID upside-down mounting pasting method and apparatus thereof
  • Large size mounting RFID upside-down mounting pasting method and apparatus thereof
  • Large size mounting RFID upside-down mounting pasting method and apparatus thereof

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Embodiment Construction

[0041] refer to figure 1 As shown, a kind of large-format sheet-packed RFID flip chip method of the present invention, the method comprises the following steps: (1) equipment initialization, each motion axis returns to the original point; The large-format sheet-mounted antenna sheets of multiple RFID antennas are placed on the wafer tray fixing module and the sheet-mounted antenna fixing module, and the positions of the chips and antennas are automatically positioned through the image recognition system, and then the wafer position files are created separately through the image recognition system and the antenna position template file; (3) The flipping head automatically flips to the wafer pick-up position, the thimble lifts up the chip, the flipping head sucks the wafer from the front and flips it, and the antenna material is installed in a large format while the flipping head picks up the crystal The board moves to the dispensing position for dispensing glue, and after the d...

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Abstract

The invention discloses a large size mounting RFID upside-down mounting pasting method and an apparatus thereof, belonging to the RFID pasting technology field. The apparatus comprises a pedestal which is provided with a support. A wafer plate fixing module and a large size mounting antenna fixing module are provided under the support, and a dispensing module is provided on the support above the mounting antenna fixing module. An automatic chip overturn placing module is provided between the wafer plate fixing module and the mounting antenna fixing module. The wafer plate fixing module, the mounting antenna fixing module, the dispensing module and the automatic chip overturn placing module are connected with a control unit respectively. The method mainly comprises the following steps: device initialization, wafer plate and antenna material plate positioning, overturn head wafer picking and overturning, placing head wafer picking, dispensing, and wafer solidification. The invention is aimed at providing the large size mounting RFID upside-down mounting pasting method and the apparatus thereof with compact structure, convenient usage and automatic pasting realization. The method and the apparatus are used for RFID pasting.

Description

technical field [0001] The present invention relates to a kind of RFID sticking method, more specifically, relate to a kind of large-format sheet-packed RFID flip-chip sticking method. The invention also relates to a device for implementing the above method. Background technique [0002] Traditional RFID placement machines are divided into two categories: fully automatic flip chip roll placement machines, and semi-automatic full sheet placement machines. The former is mainly for the RFID patches of roll-up antennas in large quantities. Its main advantages are fast speed, high output and fully automatic. However, due to the complicated initial commissioning of the automatic roll-to-roll machine, it can only be applied to roll-to-roll printing process antennas, and it is difficult to apply to the production of proofing, small batches or non-roll-to-roll printing process RFID antennas. However, the semi-automatic front-mounting chip mounter needs to manually take and turn th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50H01L21/58H01Q1/22H01L21/67
Inventor 罗泽刚叶孟荣吴端梁游张利利
Owner 广东宝丽华服装有限公司
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