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Surface treating agent for quickly increasing surface roughness and deoxidizing for circuit board

A surface roughness and surface treatment agent technology, applied in the field of metal surface treatment agents, can solve problems such as instability, easy decomposition of hydrogen peroxide, and insufficient roughness of metal surface treatment, and achieve long service life, stable composition, and good roughness Effect

Inactive Publication Date: 2014-01-29
东莞市富默克化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the existing technology is not rough enough for the metal surface, making it difficult to obtain a good lamination effect
Especially for the preparation of some small circuit boards, if the metal surface is not rough enough, it is difficult to prepare ideal circuit boards
In addition, the surface treatment agent of the prior art is unstable because it contains easily decomposed substances, for example, the hydrogen peroxide contained in the etchant is easily decomposed when heated

Method used

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  • Surface treating agent for quickly increasing surface roughness and deoxidizing for circuit board
  • Surface treating agent for quickly increasing surface roughness and deoxidizing for circuit board
  • Surface treating agent for quickly increasing surface roughness and deoxidizing for circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Add 10g of potassium monopersulfate, 500g of potassium dihydrogen phosphate, 20g of phosphoric acid with a mass concentration of 85% to the reactor, add deionized water to make the volume to 1L, and stir evenly to obtain a circuit board for quickly increasing the surface area. Surface treatment for roughness and deoxidation.

[0020] The surface treatment agent obtained in this example has a fast etching rate, stable composition and long service life. The metal substrate is soaked with the surface treatment agent obtained in this example. The temperature of the surface treatment agent is 36° C., and the soaking time is 1 min. Then, the processed metal surface is observed and photographed with a scanning electron microscope, and it can be observed that the metal surface has a good surface roughness.

Embodiment 2

[0022] Add 110g of ammonium persulfate, 100g of diammonium hydrogen phosphate, 190g of nitric acid with a mass concentration of 65%, add deionized water to 1L, and stir evenly to obtain a circuit board for quickly increasing the surface roughness and deoxidizing surface treatment agents.

[0023] The surface treatment agent prepared in this example has fast etching rate, stable composition and long service life. The metal substrate is soaked with the surface treatment agent obtained in this example. The temperature of the surface treatment agent is 36° C., and the soaking time is 2 minutes. Then, the processed metal surface is observed and photographed with a scanning electron microscope, and it can be observed that the metal surface has a good surface roughness.

Embodiment 3

[0025] Add 130g of sodium persulfate, 160g of disodium hydrogen phosphate, 450g of hydrochloric acid with a mass concentration of 37% to the reactor, add deionized water to make it up to 1L, and stir evenly to obtain a circuit board for rapidly increasing surface roughness. Degree and deoxidation surface treatment agent.

[0026] The surface treatment agent prepared in this example has fast etching rate, stable composition and long service life. The metal substrate is soaked with the surface treatment agent obtained in this example. The temperature of the surface treatment agent is 36° C., and the soaking time is 2 minutes. Then, the processed metal surface is observed and photographed with a scanning electron microscope, and it can be observed that the metal surface has a good surface roughness.

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Abstract

The invention relates to the technical field of metal surface treating agents, and in particular relates to a surface treating agent for quickly increasing surface roughness and deoxidizing for a circuit board. The surface treating agent is composed of the following raw materials: 1-500g / L of peroxy oxidant, 1-500g / L of hydrophosphate, 1-500g / L of inorganic acid and the balance of deionized water, wherein the peroxy oxidant is any one or the mixture of some of potassium persulfate, sodium persulfate, ammonium persulphate and potassium monopersulfate at any ratio; the hydrophosphate is any one or the mixture of some of diammonium hydrogen phosphate, dipotassium phosphate, disodium hydrogen phosphate, ammonium dihydrogen phosphate, monopotassium phosphate and sodium dihydrogen phosphate at any ratio; and the inorganic acid is any one or the mixture of some of sulfuric acid, hydrochloric acid, phosphoric acid and nitric acid. The surface treating agent has the advantages of stable ingredient and long service life, and the metal surface has better roughness after being subjected to microetching.

Description

technical field [0001] The invention relates to the technical field of metal surface treatment agents, in particular to a surface treatment agent for rapidly increasing surface roughness and deoxidation of circuit boards. Background technique [0002] In the process of manufacturing circuit boards, in order to improve the adhesion of the metal and facilitate the subsequent pressing process of the process, it is necessary to remove the oxide on the surface of the metal before using it. At present, surface treatment agents with strong oxidizing properties are often used to remove oxides on the metal surface and form a rough surface. [0003] However, the treatment of the metal surface in the existing technology is not rough enough, making it difficult to obtain a good lamination effect. Especially for the preparation of some small circuit boards, if the metal surface is not rough enough, it is difficult to prepare ideal circuit boards. In addition, the prior art surface trea...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23G1/02C23F1/16
Inventor 王维仁伊洪坤
Owner 东莞市富默克化工有限公司