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separation device

A separation device and waste liquid separation technology, applied to electrostatic separators, etc., can solve problems such as reusing difficult liquids, mesh clogging, and poor centrifugal separation efficiency

Active Publication Date: 2015-11-18
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the physical method as described above, there is a problem that clogging of the mesh occurs during filtration, or silicon particles pass through
Especially in the centrifugation method, there are cases where the concentration of silicon particles relative to water is too dilute and the efficiency of centrifugation is poor.
In addition, in the above-mentioned chemical method, since chemicals are used, there is a problem that it is difficult to reuse the liquid (water)

Method used

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no. 1 approach

[0027] figure 1 and figure 2 The separation device 1 according to the first embodiment of the present invention is shown. figure 1 is a perspective view of the separation device 1, figure 2 yes figure 1 Section view of II-II. The separation device 1 includes: a water tank 2 that stores waste liquid 4 containing silicon chips 5 in water; and a silicon separation mechanism 3 that is disposed in the water tank 2 .

[0028] The water tank 2 is a cuboid-shaped container with an open top. Such as figure 2 As shown, a supply nozzle 6A of a waste liquid supply pipe 6 is arranged above the water tank 2, and the waste liquid 4 is supplied from the supply nozzle 6A. In addition, if figure 2 As shown, on the side wall 2B of the water tank 2 away from the area where the supply nozzle 6A is disposed, there is provided a delivery unit (outlet) 7 for taking out the water 4A from which the silicon chips 5 have been removed.

[0029] The silicon separation mechanism 3 is provided wi...

no. 2 approach

[0036] Figure 3-5 The separation device 20 according to the second embodiment of the present invention is shown. image 3 is an exploded perspective view of the separation device 20, Figure 4 is a perspective view of the separation device 20, Figure 5 yes Figure 4 The V-V section view. The separation device 20 includes: a water tank 21 storing waste liquid 4 containing silicon chips 5 in water; and a silicon separation mechanism 22 arranged in the water tank 21 .

[0037] The water tank 21 is a rectangular parallelepiped container with an open top. A waste liquid supply pipe 23 is inserted through one wall portion 21A of the water tank 21 , and a supply nozzle 23A at the end of the waste liquid supply pipe 23 is disposed inside the water tank 21 . Accordingly, the waste liquid 4 is supplied into the water tank 21 from the supply nozzle 23A. In addition, a drain pipe 24 for preventing the waste liquid 4 from overflowing out of the water tank 21 is provided at a positi...

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Abstract

The invention provides a separating device, which can separate a waste liquid comprising silicon scraps into silicon scraps and water in a state of easy reuse in high efficiency. The separating device comprises: a water tank (2) storing the waste liquid (4) comprising the silicon scraps (5) in water; and a silicon separating mechanism (3) disposed in the water tank (2), the silicon separating mechanism (3) comprises: an adsorption plate (8) disposed in the water tank (2) and adsorbing the silicon scraps (5) in the waste liquid (4); and an areolate silicon penetrating limiting plate (9A) oppositely separately arranged with respect to the adsorption plate (8), and merely allowing water (4A) in the waste liquid (4) penetrate so as to limit penetration of the silicon scraps (5), and the separating device is provided with a voltage applying circuit (10) as an electric field forming component so as to make the adsorption plate (8) be a positive electrode and the silicon penetrating limiting plate (9A) be a negative electrode, thereby forming the electric field.

Description

technical field [0001] The invention relates to a separation device for separating waste liquid containing silicon chips into silicon chips and liquid. Background technique [0002] In the manufacture of silicon devices, there are a process of cutting a silicon ingot to form a silicon wafer, a process of grinding a silicon wafer, and forming an IC (Integrated Circuit) in a large number of areas arranged in a grid on the surface of a silicon wafer. , LSI (large scale integration: Large Scale Integration) and other circuits, and cut each region along predetermined intervals (cutting lines) to form silicon chips one by one. In these processes, water is used, for example, to cool cutting tools, machining points, grinding parts, etc., or to wash away silicon chips. [0003] In recent years, from the viewpoint of recycling water and silicon, a technique for separating waste liquid containing silicon chips into silicon chips and silicon-free water has been desired. Silicon dust i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B03C5/02
Inventor 石黑裕隆吉田干
Owner DISCO CORP