Baseplate conveying mechanism

Abstract

The invention discloses a baseplate conveying mechanism which is used for conveying a baseplate into a crest welder for processing and comprises a conveyer belt, a supporting element and an idler wheel arranged between the conveyer belt and the supporting element, wherein the top of the idler wheel and the conveying face of the conveyer belt are arranged at a same plane so as to provide support and traction while the baseplate is departed from the conveyer belt, so that the baseplate can be conveyed in a direction adjacent to the supporting element. Compared with the prior art, the baseplate conveying mechanism can provide steady support between the conveyer belt and the supporting element so as to avoid the problems that the baseplate deflects and drops off or electronic elements on the baseplate break away from correction positions in a conveying process.

Description

technical field [0001] The invention relates to a substrate conveying mechanism, in particular to a substrate conveying mechanism for conveying a substrate to a wave soldering machine for internal processing. Background technique [0002] With the development of science and technology, electronic products are changing with each passing day, and the use of circuit boards is becoming more and more common. Usually, in addition to the multi-layer circuits, the circuit board also needs to solder various electronic components. To complete the overall electrical function. [0003] Among various circuit board soldering techniques currently used in the industry, the wave-soldering technique is more commonly used, and this technique is especially suitable for situations where electronic components need to be plugged into the circuit board. [0004] A common wave soldering process is to first insert electronic components on a circuit board, and then send the circuit board to a wave so...

AI Technical Summary

Problems solved by technology

[0006] However, there is usually a gap between the transmission section and the wave soldering machine, and it has been found through practical experience that when the circuit board passes through the gap from the transmission section, the circuit board will break away from the transmission section. Due to the influence of gravity, the circuit board sinks slightly, causing the circuit board to be unable to be smoothly transported to the feed port of the wave soldering machine, which in turn causes the position of the circuit board itself to shift, fall, or the electronic components on the circuit board Deviating from the correct position will eventually cause problems such as damage to the circuit board, or failure of electronic components on the circuit board after wave soldering, which will increase the scrap rate and decrease the pass rate of the circuit board

[0007] Therefore, in view of the above problems, how to avoid problems such as insufficient supporting force of the circuit board transfer mechanism in the prior art during the transportation process has become an urgent problem to be solved at present.

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