Unlock instant, AI-driven research and patent intelligence for your innovation.

Process control method of multi-process machine table

A control method and multi-process technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of single-process control method and difficulty in further improving WPH, and achieve the effect of improving WPH and increasing the number of treatments

Active Publication Date: 2012-02-15
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
View PDF2 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] The entire process of the above scheme is actually only processed according to the sequence of the process route, and its process control method is simple--it is difficult to further improve the WPH of the machine

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Process control method of multi-process machine table
  • Process control method of multi-process machine table
  • Process control method of multi-process machine table

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] The main flow of the multi-process machine process control method provided by the embodiment of the present invention is as follows:

[0026] Step 1, select the bottleneck process of the multi-process machine;

[0027] Step 2, increase the waiting time of the non-bottleneck process that shares the handling equipment with the bottleneck process, preferably, the increased waiting time satisfies condition 1) and condition 2):

[0028] Condition 1) The increased waiting time is less than the time difference between the time when the wafer is transported to the bottleneck process and the time when the non-bottleneck process is completed, and greater than the time difference between the time when the wafer unloading of the bottleneck process is completed and the time when the non-bottleneck process is completed.

[0029] Condition 2) The increased waiting time is greater than the time difference between the processing completion time of the preceding process of the bottleneck...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a process control method of a multi-process machine table so as to improve WPH of the machine table. The process control method comprises the following steps of: selecting a bottleneck technology of the multi-process machine table; increasing the stay time of the non-bottleneck processes sharing carrying equipment with the bottleneck process; and carrying the wafer to be processed by the bottleneck process to the bottleneck process within the stay time of the non-bottleneck process so as to improve the WPH of the multi-process machine table by increasing the wafer processing speed of the bottleneck process.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a process control method for multi-process machines. Background technique [0002] Most of the integrated circuit manufacturing processes are completed by machines, which can carry out one process or multiple processes. This application refers to a machine capable of multiple processes as a multi-process machine. An index to measure the production rate of a machine is WPH , that is, the number of wafers that can be processed per hour. For multi-process machines, how to control the process to increase the production rate of the machine as much as possible is a key concern in the industry. [0003] figure 1 It is a structural schematic diagram of an existing multi-process machine. The following letter M indicates wafer handling, and P indicates wafer processing. The machine processes each wafer according to the following steps: [0004] Step a1 (M1): Load the wafer fro...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/67
Inventor 赵波
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP