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Process control method of multi-process machine

A control method and multi-process technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as difficult to further improve WPH, single-process control method, etc., and achieve the effect of increasing WPH and increasing the number of processes

Active Publication Date: 2016-06-22
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] The entire process of the above scheme is actually only processed according to the sequence of the process route, and its process control method is simple--it is difficult to further improve the WPH of the machine

Method used

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Embodiment Construction

[0025] The main flow of the multi-process machine process control method provided by the embodiment of the present invention is as follows:

[0026] Step 1, select the bottleneck process of the multi-process machine;

[0027] Step 2, increase the waiting time of the non-bottleneck process that shares the handling equipment with the bottleneck process, preferably, the increased waiting time satisfies condition 1) and condition 2):

[0028] Condition 1) The increased waiting time is less than the time difference between the time when the wafer is transported to the bottleneck process and the time when the non-bottleneck process is completed, and greater than the time difference between the time when the wafer of the bottleneck process is completed and the time when the non-bottleneck process is completed.

[0029] Condition 2) The increased waiting time is greater than the time difference between the processing completion time of the preceding process of the bottleneck process a...

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Abstract

The invention provides a process control method of a multi-process machine, in order to improve the WPH of the machine. The process control method includes the steps of: selecting a bottleneck process of a multi-process machine, increasing the waiting time of a non-bottleneck process that shares handling equipment with the bottleneck process, Then, during the waiting time of the non-bottleneck process, the wafers that need to be processed by the bottleneck process are transported to the bottleneck process, so as to increase the WPH of the multi-process machine by accelerating the wafer processing rate of the bottleneck process.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a process control method for multi-process machines. Background technique [0002] Most of the integrated circuit manufacturing processes are completed by machines, which can carry out one process or multiple processes. This application refers to a machine capable of multiple processes as a multi-process machine. An index to measure the production rate of a machine is WPH , that is, the number of wafers that can be processed per hour. For multi-process machines, how to control the process to increase the production rate of the machine as much as possible is a key concern in the industry. [0003] figure 1 It is a structural schematic diagram of an existing multi-process machine. The following letter M indicates wafer handling, and P indicates wafer processing. The machine processes each wafer according to the following steps: [0004] Step a1 (M1): Load the wafer fro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
Inventor 赵波
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP