Capsulation structure of surface light source including a plurality of reflection cups

Abstract

The invention discloses a capsulation structure of a surface light source including a plurality of reflection cups. The capsulation structure comprises a base plate and an electrode arranged on the base plate; a plurality of small reflection cups are arranged on the base plate; LED (Light-Emitting Diode) chips are arranged at the bottoms of inner cavities of the small reflection cups; a capsulation material with a reflectivity of n is covered on the LED chip, wherein the inner cavities of the small reflection cups are in the shape of a round table body with a large upper part and a small lower part; the size of a taper angle 2beta of the inner cavity of each small reflection cup meets a formula: pi / 2-arcsin(1 / n)<2beta<2arcsin(1 / n), wherein beta is an included angle formed between the inner wall of the small reflection cup and a vertical direction of the base plate. According to the capsulation structure provided by the invention, a plurality of the small reflection cups are arranged on the base plate and the LED chips are arranged at the bottoms of the inner cavities of the small reflection cups while the taper angles of the inner cavities of the small reflection cups are properlyarranged, so that the light-emitting efficiency can be greatly improved.

Description

technical field [0001] The invention relates to an LED surface light source in the field of LED packaging, in particular to a surface light source packaging structure containing a plurality of reflective cups in which the value range of the taper angle of the inner cavity of the reflective cup is determined according to the refractive index of the packaging material. Background technique [0002] In the traditional multi-chip LED light source module, the LED chips are directly placed on the surface of the substrate, that is, the chips are on the same plane, and the circuit is formed by micro-welding gold wires, and then sealed with glue. [0003] For example, a kind of LED surface light source disclosed in the Chinese patent document whose patent application number is 200610062089.X, such as Figure 1a As shown, a metal heat-conducting material is used as the substrate 3, and plastic is used as the reflective cup 6. Several LED chips 4 are directly arranged on the substrate s...

AI Technical Summary

Problems solved by technology

[0004] 1. Part of the light emitted by the LED chip is prone to total reflection on the top of the surface light source, which affects the light output efficiency of the surface light source;

[0005] 2. The light emitted from the side of the LED chip has not been effectively utilized, and part of the light is lost due to mutual absorption between the LED chips, which affects the light output efficiency of the surface light source;

[0006] 3. Adjacent LED chips interfere with each other, affecting each other's working environment, directly causing the temperature of adjacent LED chips to rise, which in turn affects the light output efficiency of adjacent LED chips;

However, in the case where the refractive index n of the LED device packaging material is unknown, limiting the angle between the inner wall surface and the bottom of the concave cup or the size of the cone angle (greater than 90 degrees) still cannot solve the problem that part of the light emitted by the LED chip will be in the The problem of total reflection on the surface of the optical lens of the LED device still has the problem of affecting the light extraction efficiency of the LED device

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