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Flux suitable for various tin-based solder pastes and preparation method thereof

A technology of flux and solder paste, used in welding equipment, welding media, manufacturing tools, etc., can solve the problems of affecting the stability of solder paste, poor applicability of flux, delamination, etc., to improve stability and improve wettability. , the effect of reducing the reaction speed

Active Publication Date: 2017-03-15
云南锡业新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

First of all, if the components in the flux are well matched and dissolved, delamination is likely to occur, and sometimes a small amount of crystalline particles will appear in the flux, which will cause sanding, which will affect the stability of the solder paste
Secondly, the applicability of the flux is poor. Generally, the fluxes used in leaded and lead-free solder pastes are different. The main reason is that the melting points of the alloy powders used for the two solder pastes are different, and the activation temperature of the fluxes required is also different. different, so the flux that needs to be prepared can show better activity at different soldering temperatures

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Prepare raw materials according to the following weight ratio: hydrogenated rosin 20.0%, KE-604 30.0%, diethylene glycol dimethyl ether 10.0%, diethylene glycol octyl ether 28.0%, sebacic acid 1.49%, sodium phytate 0.01%, ST 5.0%, lauryl hydroxystearic acid amide 1.5%, abietyl-trimethylammonium chloride 0.3%, abietyl alcohol ether 0.7%, ricinoleoyl diethanolamine 3.0%.

[0027] Specific preparation method:

[0028] 1) Melt ordinary hydrogenated rosin in a reactor at a temperature of 140°C to 150°C.

[0029] 2) Slowly add the solvent into the molten rosin, keep the temperature at 130°C-140°C, stir for 10 minutes, then add active agent and surfactant, and stir for 10 minutes.

[0030] 3) Cool the material to 70℃~80℃, finally add thixotropic agent and stir for 30 minutes

[0031] 4) Cool to room temperature to obtain the flux of the present invention.

Embodiment 2

[0033] Prepare raw materials according to the following weight ratio: water white rosin 25.0%, polymerized rosin 20.0%, diethylene glycol diethyl ether 15.0%, diethylene glycol octyl ether 23.0%, succinic acid 2.45%, sodium phytate 0.05%, ST 6.5 %, lauryl hydroxystearic acid amide 2.5%, abietyl bis-trimethylammonium chloride 1.0%, abietyl alcohol ether 1.5%, ricinoleoyl diethanolamine 3.0%.

[0034] Concrete preparation method is identical with embodiment 1.

Embodiment 3

[0036] Prepare raw materials according to the following weight ratio: KR-610 20.0%, KE-604 25.0%, ethylene glycol monobutyl ether 18.0%, diethylene glycol monohexyl ether 20.0%, sebacic acid 2.48%, adipic acid 1.5%, Potassium Phytate 0.02%, ST 5.5%, Lauryl Hydroxystearamide 2.5%, Rosinyl Bis-Trimethylammonium Chloride 1.0%, Rosin Alcohol Ether 1.5%, Ricinoleyl Diethanolamine 2.5%.

[0037] Concrete preparation method is identical with embodiment 1.

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PUM

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Abstract

The invention discloses a flux suitable for multiple tin-based welding pastes and a preparation method thereof, relates to a formula of a flux for tin welding pastes and a preparation process, relates to a welding aid material of a surface mount technology (SMT), and belongs to the technical field of welding materials. The flux comprises the following components in percentage by weight: 30.0 to 40.0 percent of solvent, 1.0 to 4.5 percent of active agent, 1.0 to 3.0 percent of wetting agent, 2.0 to 5.0 percent of emulsifying agent, 3.0 to 10.0 percent of thixotropic agent and the balance of film forming agent, wherein the film forming agent is a mixture of two film forming agents, the softening point temperatures of which are respectively in an upper limit range and a lower limit range; and the solvent is a mixture of two solvents, the boiling point temperatures of which are respectively at 150 to 215 DEG C and 220 to 280 DEG C. The prepared flux has strong activity and good welding property and storage stability at different welding temperatures, and can be used for preparing conventional lead-containing or lead-free soldering paste products of Sn63Pb37, SnAg3.0Cu.5, SnAg0.3Cu0.7 and the like.

Description

technical field [0001] The invention relates to a formula and a preparation process of a soldering flux for solder paste, which is used as a soldering flux material for SMT and belongs to the technical field of soldering materials. Background technique [0002] Solder paste is mainly used in surface mount technology (SMT) welding. With the increasing miniaturization and high performance of information equipment, SMT has become the mainstream technology of electronic assembly. Among them, the use of solder paste welding is a key process in the SMT process. It directly determines the performance and quality of electronic products. On the other hand, the soldering quality depends not only on the quality of the solder powder, including the sphericity, oxygen content, particle size distribution, etc. of the solder powder, but also on the performance of the flux in the solder paste, and the stability of the flux is Determine the prerequisites for the stability of solder paste, so...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/362
Inventor 秦俊虎刘宝权白海龙古列东吕金梅沙文吉汤凤甦赵玲彦朵云琨
Owner 云南锡业新材料有限公司
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