Ball grid array package structure and manufacturing method thereof
A technology of packaging structure and ball grid array, which is applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the problems of poor signal integrity, complex process steps, long metal lines, etc., and achieves low cost and simple process. , the effect of high electrical performance
Active Publication Date: 2016-04-13
SAMSUNG SEMICON CHINA RES & DEV +1
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Problems solved by technology
[0004] However, because the existing BGA package structure needs to be manufactured through a wire bonding process, its cost is high, and due to the long metal wires, the signal integrity is poor and the process steps are complicated
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[0018] Hereinafter, a lead wire heating device according to an embodiment of the present invention will be described in detail with reference to the drawings. However, the present invention can be implemented in many different ways and should not be construed as being limited to the following examples. In the drawings, the dimensions are exaggerated for clarity, and the same reference numerals are used in different drawings to designate the same components.
[0019] figure 1 is a schematic diagram of the upper surface of the chip according to the present invention, figure 2 is a side view of a chip according to the invention, image 3 is a cross-sectional view of a substrate according to the present invention, Figure 4 It is a schematic diagram of a ball grid array package structure according to the present invention.
[0020] It can be seen from the figure that a plurality of pads 11 and fixing units 12 are formed on the upper surface of the chip 10 according to the pre...
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The invention provides a ball grid array packaging structure and a manufacturing method thereof. The ball grid array packaging structure includes: a chip, on which a fixing unit and a plurality of pads are formed on the upper surface; The placement unit corresponding to the unit and a plurality of through holes corresponding to each of the pads, the chip is flip-chip to make the fixed unit contact with the placement unit, and expose each of the through holes The pad corresponding to the through hole. According to the ball grid array package structure and its manufacturing method of the present invention, the chip is flipped on the substrate, and each pad on the chip is exposed through the through hole provided on the substrate, and the pad is protected by a conductive material and directly on the solder pad. The balls are planted on the plate, thereby achieving low cost, simple process, and high electrical performance.
Description
technical field [0001] The invention relates to a ball grid array packaging structure and a manufacturing method thereof, in particular to a ball grid array packaging structure and a manufacturing method thereof that improve electrical performance by flipping a chip onto a substrate. Background technique [0002] Ball grid array (BGA) packaging technology is a surface mount package, which replaces traditional leads by making ball bumps (ballbumps) in an array on the back of the substrate, making semiconductor devices more integrated and high performance. better. BGA packaging technology will significantly increase the number of I / O pins of the device and reduce the pad pitch, thereby reducing the size of the package and saving the footprint of the package, so that PC chipsets, microprocessors, etc. performance, miniaturization of multi-pin packaged devices is possible. With the increasing demand for packaging technology and product diversification, high speed, low cost, sm...
Claims
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IPC IPC(8): H01L23/488H01L21/60
CPCH01L24/82
Inventor 马慧舒
Owner SAMSUNG SEMICON CHINA RES & DEV