Mobile phone with liquid metal radiating module group

A liquid metal and heat dissipation module technology, applied in the structure of telephones, etc., can solve the problem of heat dissipation of chip energy, and achieve the effect of reducing calculation speed and easy heat dissipation

Active Publication Date: 2012-03-14
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a brand-new mobile phone with a liquid metal heat dissipation mechanism, which effectively solves the heat dissipation problem of the energy generated by the chip when the high-performance mobile phone is working

Method used

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  • Mobile phone with liquid metal radiating module group
  • Mobile phone with liquid metal radiating module group
  • Mobile phone with liquid metal radiating module group

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] attached figure 1 It is a structural schematic diagram of a mobile phone with a liquid metal cooling module group of the present invention; figure 2 It is a schematic structural diagram of a liquid metal heat dissipation module driven by manpower in this example; as can be seen from the figure, the mobile phone with a liquid metal heat dissipation module set provided by the present invention includes:

[0035] The mobile phone chipset 8, mobile phone battery 4 and mobile phone cover 5 that are placed in the base at the back of the mobile phone base 3 and placed in sequence;

[0036] Connect with wire between described mobile phone chipset 8, mobile phone display screen 7, mobile phone battery 4 and mobile phone keyboard 6;

[0037] The mobile phone base 3 described in this embodiment includes a mobile phone chipset 8 and connecting wires between the chipset and the mobile phone display screen, the mobile phone battery, and the mobile phone keyboard.

[0038] The mobi...

Embodiment 2

[0049] attached figure 1 It is a structural schematic diagram of a mobile phone with a liquid metal cooling module group of the present invention; image 3It is a schematic structural diagram of a liquid metal heat dissipation module driven by a micropump in this example; it can be seen from the figure that the mobile phone with a liquid metal heat dissipation module set provided by the present invention includes:

[0050] The mobile phone chipset 8, mobile phone battery 4 and mobile phone cover 5 that are placed in the base at the back of the mobile phone base 3; and the circuit module 2 above the mobile phone battery 4 in the base at the back of the mobile phone base 3;

[0051] The mobile phone display screen 7 and the mobile phone keyboard 6 in the front support of the mobile phone base 2;

[0052] The mobile phone chipset 8, the mobile phone display screen 7, the mobile phone keyboard 6, the mobile phone battery 4 and the circuit module 2 are electrically connected with ...

Embodiment 3

[0069] attached figure 1 It is a structural schematic diagram of a mobile phone with a liquid metal cooling module group of the present invention; image 3 It is a schematic structural diagram of a liquid metal heat dissipation module driven by a micropump in this example; it can be seen from the figure that the mobile phone with liquid metal heat dissipation provided by the present invention includes:

[0070] The mobile phone chipset 8, mobile phone battery 4 and mobile phone cover 5 that are placed in the base at the back of the mobile phone base 3; and the circuit module 2 above the mobile phone battery 4 in the base at the back of the mobile phone base 3;

[0071] The mobile phone display screen 7 and the mobile phone keyboard 6 in the front support of the mobile phone base 2;

[0072] The mobile phone chipset 8, the mobile phone display screen 7, the mobile phone keyboard 6, the mobile phone battery 4 and the circuit module 2 are electrically connected with wires;

[0...

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Abstract

The invention relates to a mobile phone with a liquid metal radiating module group. The mobile phone comprises a mobile phone chip set, a mobile phone battery and a mobile phone cover which are positioned in a base on the back of the mobile phone and arranged in turn, and a mobile phone display screen and a mobile phone keyboard which are positioned in a base on the front of the mobile phone. The mobile phone is characterized by also comprising the liquid metal radiating module group positioned between the mobile phone chip set and the mobile phone battery which are positioned in the base on the back of the mobile phone, wherein the liquid metal radiating module group consists of at least one liquid metal radiating module; the liquid metal radiating module comprises a hollow sealed annular channel and liquid metal filled in the hollow sealed annular channel; and the liquid metal is gallium, sodium, potassium, mercury, indium-gallium alloy, sodium-potassium alloy or gallium- indium-tin alloy which are in a liquid state at normal temperature. The mobile phone can solve the problem of radiation of the mobile phone chip set by means of the flowing of the liquid metal, and the working performance of the mobile phone is improved.

Description

technical field [0001] The invention relates to a mobile phone with a liquid metal heat dissipation mechanism, in particular to a built-in liquid metal flow channel, which drives the liquid metal to flow in the flow channel through a micropump or the active / passive movement of the human body, thereby outputting the heat generated by the heating chip to the surroundings High-performance mobile phones to reduce the temperature of hot spots. Background technique [0002] In the current social life, the mobile phone has moved from the original communication tool to the role of life assistant. As mobile phones integrate more and more functions, the heat generated by their chips will gradually exceed the previous level, and the trend of higher heat density is still moving rapidly. At present, the computing power of some mobile phones is close to that of notebook computers, and the enhancement of the computing power of mobile phones has led to a corresponding increase in the power...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04M1/02
Inventor 刘静邓月光葛浩山
Owner TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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