Supercharge Your Innovation With Domain-Expert AI Agents!

Radiating device and electronic device using same

A technology for heat dissipation devices and electronic components, which is applied in the direction of circuits, electrical components, and electric solid devices, and can solve problems such as the inability to meet the heat dissipation requirements of electronic components, and achieve the effects of compact structure, uniform heat dissipation, and weight reduction

Inactive Publication Date: 2012-03-14
FURUI PRECISE COMPONENT (KUNSHAN) CO LTD +1
View PDF4 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Traditionally, the same heat dissipation fin group has the same material, and the fins on the same heat dissipation fin group are basically the same shape, but with the difference in the size of the internal space of the computer and the heat dissipation requirements, this design can no longer meet the needs of various electronic components. cooling needs

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Radiating device and electronic device using same
  • Radiating device and electronic device using same
  • Radiating device and electronic device using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0058] Such as figure 1 and figure 2 As shown, it shows an electronic device 100 according to an embodiment of the present invention, the electronic device 100 includes a heat sink 10, a central processing unit 20, a chip 30 and a circuit board 40, the central processing unit 20 and the chip 30 Installed on the circuit board 40 , the cooling device 10 is used to dissipate heat from the CPU 20 and the chip 30 . The heat generated by the CPU 20 is greater than the heat generated by the chip 30 during operation.

[0059] The cooling device 10 includes a centrifugal fan 12, a heat pipe 11 wound around the periphery of the centrifugal fan 12, a first fin group 13 and a second fin group 14 matched with the opposite ends of the heat pipe 11, and a central processing unit. 20 attached to a first heat absorbing plate 15 and a second heat absorbing plate 16 attached to the chip 30 .

[0060] The heat pipe 11 is flat and includes a first condensation section 111 located at one end of ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a radiating device which comprises a radiating fin group, a heat pipe and a fan, wherein the radiating fin group comprises a first fin group and a second fin group, the fan is provided with a first air outlet and a second air outlet, the first fin group is arranged at the first air outlet of the fan, the second fin group is arranged at the second air outlet of the fan, the heat pipe is in contact with the first fin group and the second fin group, and the first fin group and the second fin group are made of different materials. Compared with the prior art, the first fin group and the second fin group in the radiating device are made of different materials, thereby achieving the purposes of saving cost, reducing weight and the like, enabling the internal structure of a notebook computer to be more compact and enabling the heat radiation to be more uniform. The invention further relates to an electronic device using the radiating device.

Description

technical field [0001] The invention relates to a heat dissipation device and an electronic device using the heat dissipation device. Background technique [0002] At present, in computer products, in addition to the central processing unit, other electronic components such as chips generate more and more heat during the working process. Therefore, while cooling the central processing unit, it is also necessary to dissipate heat from other electronic components such as chips. [0003] Commonly used heat dissipation devices generally include a heat absorbing plate, a heat pipe, a fan and a heat dissipation fin group formed by stacking heat dissipation fins. The heat absorbing plate is attached to a heat generating electronic component on a circuit board to absorb Generated heat, and transfer the heat to the heat pipe, through the heat pipe to the cooling fin group, the heat is dissipated by the cooling fin group and the fan. Due to the limited space in the notebook computer,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/34
Inventor 陈荣安
Owner FURUI PRECISE COMPONENT (KUNSHAN) CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com