Silicon microphone and packaging structure of product applying same

Abstract

The invention provides a silicon microphone and a packaging structure of a product applying same, wherein the silicon microphone comprises a shell and a circuit board which form the external packaging structure of the silicon microphone, an MEMS (Micro-electromechanical Systems) chip is arranged on the surface of the circuit board inside the packaging structure, sound holes used for receiving external sound signals are arranged in the packaging structure, and the surface of the external periphery of the sound holes is provided with a deep-color coating. The invention can realize good light and noise reducing effects only by a manner that the deep-color coating is arranged around the sound holes in the external surface of the silicon microphone, is simple to design and easy to realize, can not increase the production cost and the size of products, and can not affect the picking-up effect of the product.

Description

technical field [0001] The present invention relates to the technical field of electroacoustic converters, and more specifically, relates to a silicon microphone capable of preventing light noise and a package structure of its application products. Background technique [0002] With the progress of society and the development of technology, in recent years, as the volume of electronic products such as mobile phones and notebook computers has been continuously reduced, people have higher and higher requirements for the performance of these portable electronic products, which also require matching electronic products. Parts continue to shrink in size, performance and consistency. In this context, many new products have been launched in the field of microphone products, one of the important parts of the above-mentioned portable electronic products, among which silicon microphones realized in batches using semiconductor manufacturing and processing technology are representative ...

AI Technical Summary

Problems solved by technology

[0004] However, since the working principle of the silicon microphone requires that its structure must have a sound hole connected to the external space, this makes it easy for external light to irradiate into the silicon microphone through the sound hole 51 of the mobile phone, the sound hole 61 of the rubber sleeve and the sound hole 21 of the silicon microphone. Inside, and irradiate on the MEMS chip, this will bring some interference to the work of the MEMS chip, commonly known as "light noise"

Moreover, in order to ensure the transmission of sound signals and the need to ensure the acoustic performance, the sound hole 51 of the mobile phone, the sound hole 61 of the rubber sleeve and the sound hole 21 of the silicon microphone cannot be designed too small, otherwise the sound pickup effect of the silicon microphone will be affected

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