Back plate, backlight module utilizing same and liquid crystal display device

Abstract

The present invention discloses a backplane, a backlight module using the same, and an LCD device, wherein the backplane comprises a main frame which comprises a plurality of brackets, and bridges which are arranged on the brackets and used for fixing PCBs; the bridges can rotate relative to the fixed points of the bridges to the brackets. In the present invention, because the backplane forms a frame structure through a plurality of brackets and the frame is provided with the bridges used for installing components such as PCBs and the like, both of the brackets and the bridges can be formed by combining universal shaping pieces; the manufacturing cost is lower; a large number of materials are saved. Simultaneously, the bridges can rotate relative to the fixed points of the bridges to the brackets, so that the positions of hillocks on the bridges can be adjusted when the bridges rotate; and then, the hillocks correspond to the locking points of the corresponding PCBs to satisfy the needs of the PCBs of different dimensions and enhance the universality of the backplane.

Description

technical field [0001] The invention relates to the field of liquid crystal display, and more specifically, relates to a backplane, a backlight module and a liquid crystal display device using the backplane. Background technique [0002] The LCD modules currently in mass production all use integral backplanes. Generally, metal stamping or plastic injection is used for integral molding, which makes the product relatively heavy and the material cost of the product is relatively high. Large-sized products need to use larger stamping equipment, the cost is high, the corresponding mold size is large, the structure is complex, and the mold cost is also high. Such as figure 1 Shown is a schematic diagram of an existing backplane structure. The backplane is formed by punching a whole piece of metal. At the same time, a convex shell 80 for fixing the PCB is punched out on the board surface. It has a lot of consumables and weighs Larger, the processing process is also loaded down w...

AI Technical Summary

Problems solved by technology

like figure 1 As shown in the existing backplane, the convex hull 80 on the backplane is integrally stamped and formed on the backplane when the backplane is manufactured, so that the position of the convex hull 80 on the backplane is fixed, and it is difficult to adapt to PCBs of different sizes At the same time, for PCBs of different sizes and backlight modules with different component quantity requirements, it is necessary to re-open the mold to make the corresponding backplane. For PCB boards of different sizes, it is necessary to open the mold to make a new backplane, so its versatility is not Well, and the cost of production will be higher in this case

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