Cooling device of heating element

A cooling device and heating element technology, applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems of low production efficiency, high production cost, increased volume, etc., and achieve the effect of high production efficiency, low cost and simple structure

Active Publication Date: 2012-11-21
JIANGSU EASTONE TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Under the same conditions, the coil cooling device has low heat exchange efficiency, so the volume must be increased to achieve the cooling effect, which is difficult to meet the requirements in a compact power supply design; in addition, the coil cooling device is affected by the process conditions. Restrictions, low production efficiency, high production costs

Method used

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  • Cooling device of heating element
  • Cooling device of heating element

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Experimental program
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Embodiment Construction

[0011] The cooling device for the heating element of the present invention will be further described in detail through specific embodiments below.

[0012] Such as figure 1 , figure 2 As shown, the cooling device for the heating element includes heat exchange tubes arranged in the power supply cabinet 1, the cabinet wall of the power supply cabinet 1 is provided with an inner medium inflow assembly 2 and an inner medium outflow assembly 3, and the two ends of the heat exchange tube They are respectively connected to the inner medium inflow assembly 2 and the inner medium outflow assembly 3. A frame 4 is arranged on one side of the power cabinet 1, and a plate heat exchanger 5 is arranged in the frame 4. In the plate heat exchanger 5 Including the first heat exchange pipeline and the second heat exchange pipeline, the frame 4 is provided with an inner medium container 6 and a circulating pump 7, the inlet of the inner medium container 6 is connected with the inner medium outf...

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Abstract

The invention relates to a cooling device of a heating element. The cooling device comprises a heat exchange tube that is arranged in a power supply cabinet; an inner medium inflow set part and an inner medium outflow set part are arranged at a cabinet wall of the power supply cabinet; and two ends of the heat exchange tube are respectively connected with the inner medium inflow set part and the inner medium outflow set part. Besides, one side of the power supply cabinet is provided with a rack; a plate type heat exchanger is arranged in the rack and an inner medium container and a circulating pump are arranged on the rack; an inlet of the inner medium container is connected with the inner medium outflow set part through a pipeline; an outlet of the inner medium container is connected with an inlet of the circulating pump through a pipeline; an outlet of the circulating pump is connected with one end of a first heat exchange pipeline of the plate type heat exchanger through a pipeline; and the other end of the first heat exchange pipeline is connected with the inner medium inflow set part through a pipeline. In addition, two ends of a second heat exchange pipeline of the plate type heat exchanger are respectively an inlet and an outlet of an outer medium. The cooling device provided in the invention is suitable for cooling of a heating element in a power supply.

Description

technical field [0001] The invention relates to a cooling device for heating elements in a power supply. Background technique [0002] At present, there is a coil cooling device used in the power supply industry to cool the heating elements in the power supply. Under the same conditions, the coil cooling device has low heat exchange efficiency, so the volume must be increased to achieve the cooling effect, which is difficult to meet the requirements in a compact power supply design; in addition, the coil cooling device is affected by the process conditions. Restrictions, low production efficiency, and high production costs. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a cooling device for heating elements with high heat exchange efficiency, small volume, high manufacturing efficiency and low cost. [0004] In order to solve the above problems, the technical solution adopted by the present invention is: the c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
Inventor 丁冬
Owner JIANGSU EASTONE TECH
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