Diamond cutting line slicing machine for cutting crystal silicon rod

Abstract

The invention provides a diamond cutting line slicing machine for cutting a crystal silicon rod, which at least comprises a frame, first and second cutting rollers, a third cutting roller and a diamond cutting line, wherein the frame is provided with a workpiece cutting region; the first and second cutting rollers are respectively arranged at both sides of the workpiece cutting region; the third cutting roller is arranged between the first and second cutting rollers; the third cutting roller is positioned at the upper side of the same horizontal planes of the first and second cutting rollers; a distance from the third cutting roller to the first cutting roller or the second cutting roller is less than a distance from the first cutting roller to the second cutting roller; the diamond cutting line is sequentially wound on the first, third and second cutting rollers; and for the diamond cutting line, two sections of relatively short cutting lines are formed between the third cutting roller and the first cutting roller and between the third cutting roller and the second cutting roller. When the diamond cutting line operates at high speed, two crystal silicon rods are simultaneously subjected to cutting operation by the two sections of cutting lines, so that the problem of poor cutting caused by excessively high deflection degree of a steel wire due to the arrangement mode of the cutting rollers in the prior art is solved.

Description

technical field [0001] The invention relates to a multi-wire cutting technology, in particular to a diamond wire slicer for cutting crystal silicon rods. Background technique [0002] Multi-wire cutting technology is a relatively advanced silicon wafer processing technology in the world at present. Its principle is to use a high-speed moving steel wire to drive the cutting blade attached to the steel wire to rub against hard and brittle materials such as semiconductors to achieve cutting. Purpose. Compared with the traditional knife saw blade, grinding wheel and internal circle cutting, the wire cutting technology has the advantages of high efficiency, high production capacity and high precision. [0003] Existing multi-wire cutting equipment such as crystalline silicon rod slicers usually at least include: a frame, a workbench for fixing workpieces, a wire storage drum for receiving and releasing steel wires, and multiple wire storage tubes for steel wires. Guided guide w...

AI Technical Summary

Problems solved by technology

[0006] In view of the above-mentioned shortcoming of the prior art, the purpose of the present invention is to provide a diamond wire slicer for cutting crystalline silicon rods, to solve the problem that the steel wire span is large due to the arrangement of the cutting rollers in the prior art, and then When cutting, the steel wire has too much curvature, which is easy to cause poor cutting.

Images