Back panel and backlight module

Abstract

The invention discloses a back panel and a backlight module, wherein the back panel comprises a frame consisting of a plurality of brackets, and a bridge arranged on the brackets and used for fixing a PCB (Printed Circuit Board), wherein the bridge can rotate relative to fixed points of the bridge and the brackets, and the bridge is provided with a sliding chute or through hole used for installing a convex hull. Because the back panel forms a frame structure by the plurality of brackets, the manufacture cost is lower and a large quantity of materials are saved; meanwhile, the bridge can rotate relative to the fixed points of the bridge and the brackets so as to ensure that the position of the convex hull on the bridge can be regulated, demands on different sizes of PCBs are met, and generality of the back panel is improved; moreover, the bridge is provided with the sliding chute used for installing the convex hull, and the convex hull can be arranged on the corresponding in the sliding chute according to demands, transverse and vertical regulation is obtained so that arrangement points of the convex hull can be many, thus the back panel can adapt to more types of sizes of PCBs so that the generality is more excellent.

Description

technical field [0001] The invention relates to the field of liquid crystal display, and more specifically, relates to a backplane and a backlight module. Background technique [0002] The LCD modules currently in mass production all use integral backplanes. Generally, metal stamping or plastic injection is used for integral molding, which makes the product relatively heavy and the material cost of the product is relatively high. Large-sized products need to use larger stamping equipment, the cost is high, the corresponding mold size is large, the structure is complex, and the mold cost is also high. Such as figure 1 Shown is a schematic diagram of an existing backplane structure. The backplane is formed by punching a whole piece of metal. At the same time, a convex shell 80 for fixing the PCB is punched out on the board surface. It has a lot of consumables and weighs Larger, the processing process is also loaded down with trivial details. With the increasingly fierce ma...

AI Technical Summary

Problems solved by technology

like figure 1 As shown in the existing backplane, the convex hull 80 on the backplane is integrally stamped and formed on the backplane when the backplane is manufactured, so that the position of the convex hull 80 on the backplane is fixed, and it is difficult to adapt to PCBs of different sizes At the same time, for PCBs of different sizes and backlight modules with different component quantity requirements, it is necessary to re-open the mold to make the corresponding backplane. For PCB boards of different sizes, it is necessary to open the mold to make a new backplane, so its versatility is not Well, and the cost of production will be higher in this case

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