Manufacturing method for forming circuit structure on non-conductive carrier

Abstract

A manufacturing method of forming an electrical circuit on a non-conductive carrier comprises following steps. After providing an electrically non-conductive carrier, catalysts are dispersed on or in the electrically non-conductive carrier. A predetermined track structure is formed on the electrically non-conductive carrier to expose the catalysts on the surface of the predetermined track structure. The surface of the predetermined track structure containing the catalysts is metalized to form a conductor track

Description

technical field [0001] The invention relates to a manufacturing method, in particular to a manufacturing method of a non-conductive carrier forming a circuit structure. Background technique [0002] Based on the public's emphasis on the convenience and portability of 3C products, electronic products are driven towards the trend of miniaturization, light weight and multi-function. Therefore, the circuit design and manufacturing methods are also developed in the direction of light weight, small volume and thin thickness. [0003] Currently known methods for making circuits can be generally classified into two types: electroplating and electroless plating. Among them, compared with electroplating, electroless plating is also called electroless plating or autocatalytic plating, which refers to the chemical reduction of metal ions in aqueous solution under a controlled environment without electricity. plated on the substrate. The advantages of electroless plating include the c...

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Problems solved by technology

However, the metal nuclei released by the metal oxide are only for the purpose of providing the metallization reduction reaction on the surface of the predetermined circuit pattern, so the metal oxide without laser activation will lead to waste of cost, and there is no possibility of recycling sex

[0005] In addition, other well-known technologies may cause part of the catalyst to be exposed on the surface of the non-predetermined circuit, so that during the subsequent metallization, the surface of the non-predetermined circuit is also plated with metal, resulting in an increase in the defective rate of the finished product

[0006] Furthermore, in the method for manufacturing a conductor track structure disclosed in U.S. Patent No. 7,060,421, the laser power used must reach the energy released by the metal oxide from the metal core, so the life of the laser source is shortened.

However, U.S. Patent No. 5,945,213 and No. 5,076,841 have the problem of high cost when forming microcircuits on 3D curved surfaces with 3D masks.

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