Monitoring method of environmental magnetic shield of electronic scanning microscope

Abstract

The invention discloses a monitoring method of an environmental magnetic shield of an electronic scanning microscope, and the monitoring method comprises the following steps that a line drawing of a silicon wafer to be measured is selected; a plurality of measuring points are selected on one side of the line drawing, measuring data of the measuring points are collected, and measuring data of relative points of the measuring points are collected on the other side of the line drawing; first difference values among the measuring data of corresponding points on the two sides of the line drawing are calculated; the maximum difference value and the minimum difference value among the first difference values are obtained, and a second difference value between the maximum difference value and the minimum difference value is calculated and is used as a measuring result; the measuring result is recorded in an environmental magnetic shield influence control chart; and according to the measuring result recorded in the environmental magnetic shield influence control chart every time, a dynamic monitoring chart of the influence of the environmental magnetic shield is obtained. The invention provides the method for monitoring the environmental magnetic shield of the electronic scanning microscope by utilizing the line width and the line width roughness of the measured drawing.

Description

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AI Technical Summary

Benefits of technology

The technical effect that this technology improves over previous methods by dynamically measuring measurements without mistakenly identifying any errors or taking into account factors like temperature fluctuations during manufacture. This helps improve accuracy when determining how well an electronic device needs maintenance based on its performance level.

Problems solved by technology

Technological Problem: Current techniques used by modern electronic devices require precise measurements with respect to both static (no moving) environments such as air currents caused by sunlight exposure during production, which may cause errors if they are mistaken due to these factors. Additionally, current solutions only provide limited ability to detect changes over short periods of time without being able to accurately track any significant sources of magnetism outside this range.

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