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Semiconductor module including plug-in and method for producing semiconductor module including plug-in

A semiconductor and plug-in technology, applied in the field of semiconductor modules, which can solve problems such as thermo-mechanical stress cracks

Active Publication Date: 2016-06-29
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, thermomechanical stress caused by thermal cycling of the semiconductor chip causes cracks especially between the solder and the substrate

Method used

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  • Semiconductor module including plug-in and method for producing semiconductor module including plug-in
  • Semiconductor module including plug-in and method for producing semiconductor module including plug-in
  • Semiconductor module including plug-in and method for producing semiconductor module including plug-in

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Embodiment Construction

[0035] In the following detailed description, reference is made to the accompanying drawings, which form a part of the detailed description, and in the accompanying drawings are schematically shown specific embodiments in which the present invention may be practiced. In this regard, directional terms such as "top", "bottom", "front", "rear", "first", "tail", etc. are used with reference to the orientation of the described figures. Because the components of the embodiments can be positioned in a variety of different orientations, the directional terminology is used for illustrative purposes and is by no means limiting. It is understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. Therefore, the following detailed description should not be understood in a restrictive sense, and the scope of the present invention is defined by the appended claims. It is to be understood that the fea...

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Abstract

The invention relates to a semiconductor module comprising an interposer and a method for producing a semiconductor module comprising an interposer. A power semiconductor module is produced by providing a base with a metal surface and an insulating substrate comprising an insulating carrier having a bottom side provided with a bottomed metallization layer. Provides plugins for rendering wave structures. The insert is positioned between the insulating carrier and the metal surface, after which the metal surface is soldered to the bottom-side metallization and the insert with solder so that all gaps between the metal surface and the bottom-side metallization are filled with solder.

Description

Technical field [0001] The present invention relates to a semiconductor module, and particularly to a semiconductor module having an insert. Background technique [0002] Power electronic modules are semiconductor modules used in power electronic circuits. Power electronics modules are typically used in vehicle, rail and industrial applications, such as in inverters or rectifiers. They are also used in the form of energy production and transmission. The semiconductor components included in the power electronic module may include, for example, semiconductor chips, including insulated gate bipolar transistors (IGBT), metal oxide field effect transistors (MOSFET), junction field effect transistors (JFET), thyristors or diodes. These semiconductor chips may differ in their voltage and current handling capabilities. [0003] In many semiconductor modules, the semiconductor chips are arranged on a flat, metalized ceramic-based insulating substrate because the difference between the th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488H01L21/60
CPCH01L23/3735H01L2224/32225H01L2224/48227H01L2224/48472H01L2224/73265H01L2924/1301H01L23/24H01L24/29H01L24/32H01L24/48H01L24/73H01L24/83H01L25/072H01L2224/291H01L2224/29139H01L2224/8384H01L2924/13055H01L2924/13062H01L2924/13091H01L2224/4846H01L2224/29339H01L2224/48091H01L2224/8584H01L2924/01327H01L2924/1306H01L2924/1305H01L2224/451H01L2924/00014H01L2924/181H01L2924/014H01L2924/00012H01L2924/00H01L2224/45099
Inventor R.拜耶雷尔O.霍尔费尔德
Owner INFINEON TECH AG