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Heat pump type water heating apparatus

A hot water supply device, heat pump technology, applied in residential hot water supply systems, heating methods, household heating and other directions, can solve problems such as not being easy to optimally control

Active Publication Date: 2015-03-25
LG ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] According to the heat pump hot water supply device of the prior art, since the refrigerant compressed in a compressor heats water in a refrigerant-water heat exchanger, and utilizes Heated water, so raising the hot water supply temperature is accompanied by restrictions, and it is not easy to perform optimal control based on water temperature

Method used

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  • Heat pump type water heating apparatus
  • Heat pump type water heating apparatus
  • Heat pump type water heating apparatus

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Embodiment Construction

[0030] Hereinafter, description will be made with reference to the drawings of several embodiments of the present invention that specifically achieve the above objects.

[0031] figure 1 It is a structural diagram of an embodiment of the heat pump hot water supply device of the present invention, figure 2 It is a structural diagram showing the flow of refrigerant and water when heating water in an individual heating mode in an embodiment of the heat pump hot water supply device of the present invention, image 3 It is a structural diagram showing the flow of refrigerant and water when heating water in the reheating mode in an embodiment of the heat pump hot water supply device of the present invention, Figure 4 It is a structural diagram showing the flow of refrigerant and water when heating water in a multi-stage heating mode in an embodiment of the heat pump hot water supply device of the present invention, Figure 5 It is a structural diagram showing the flow of refrige...

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PUM

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Abstract

A heat pump type water heating apparatus is disclosed. The water heating apparatus includes a refrigeration cycle circuit (2) including a compressor (12), a dual heat exchanger (14), an expansion device (16), and an outdoor heat exchanger (18), via which a first refrigerant is circulated, the dual heat exchanger (14) including a first refrigerant and water heat exchanger (40) and a first refrigerant and second refrigerant heat exchanger (50), a cascade compressor (82) to compress the second refrigerant having passed through the first refrigerant and second refrigerant heat exchanger (50), a second refrigerant and water heat exchanger (84) to perform heat exchange between the second refrigerant compressed by the cascade compressor (82) and water, a cascade expansion device (86) to expand the second refrigerant having passed through the second refrigerant and water heat exchanger (84), and a water heating channel (8) connected to the first refrigerant and water heat exchanger (40) and the second refrigerant and water heat exchanger (84).

Description

technical field [0001] The invention relates to a heat pump hot water supply device, in particular to a heat pump hot water supply device which heats water with a refrigerant. Background technique [0002] Generally speaking, a heat pump is a refrigeration and heating device that transfers a low-temperature heat source to a high temperature or transfers a high-temperature heat source to a low-temperature heat source by using the heat of heat or condensation of a refrigerant. [0003] A heat pump includes a compressor, a condenser, an expansion mechanism, and an evaporator. Recently, in order to minimize the consumption of fossil fuels, there is a tendency to develop a heat pump type hot water supply device that uses refrigerant to heat water for hot water supply. [0004] The heat pump hot water supply device includes: a compressor that compresses refrigerant; a refrigerant-water heat exchanger that heats water with refrigerant compressed in the compressor; a water heat exc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F25B29/00F25B41/06F25B41/04F24H4/02
CPCF25B13/00F25B7/00F25B2313/003F25B25/005F25B2339/047F24H4/02F24D17/02F24D19/1054F24D2200/123F24H15/215F24H15/258F24H15/385F24H15/174F24H15/136F24H15/38F24H15/281
Inventor 李东赫河锺哲
Owner LG ELECTRONICS INC