Packaging material drop test system and testing method

Abstract

The invention relates to a packaging material drop test system and a testing method employing the system. The packaging material drop test system is used for testing a dropping situation of a packaging material wrapping an object requiring testing. The packaging material drop test system comprises: a flexible pressure sensor arranged on at least one side of the object requiring testing and between the object and the packaging material, and an analyzing unit coupled with the flexible pressure sensor. The analyzing unit is used for analyzing the compression status of the object in the packaging material during the dropping period according to signals transmitted by the flexible pressure sensor. With the system and the method provided by the invention, surface pressure distribution status of the object requiring testing can be obtained. When the system is used on an irregular object, pressure distribution on more than two sides of the object requiring testing can be obtained simultaneously. Therefore, duration of compression on the object requiring testing during the whole dropping period can be obtained, and the pressure values can be quantized for reference.

Description

technical field [0001] The invention provides a packaging material drop testing system and a testing method thereof, in particular to a packaging material dropping testing system and a testing method thereof which use a flexible pressure sensor to test the condition of the packaging material covering an object to be tested. Background technique [0002] Generally speaking, when electronic products are shipped, in order to ensure that electronic products can be delivered to customers safely and without damage under various transportation conditions, cushioning materials (such as EPE, EPS, etc.) will be filled in the packaging cartons. , in order to achieve the effect of protecting electronic products. Therefore, various manufacturers will set various packing drop specifications, and manufacturers must comply with the specifications when designing products and packaging materials. As far as electronic products are concerned, the current drop test specifications require that t...

AI Technical Summary

Problems solved by technology

Since the product is dropped under the packaging material and carton, it is impossible to directly observe the impact behavior when it falls, so it is not easy to judge the cause of the damage, and it is also impossible to know the local force behavior of the product. Only the experience of the engineer and Deduction to judge, it is easy to misjudge or have blind spots, which will cause the wrong direction of modification, so the number of tests and costs will be increased

In addition, clay and two-stage straws are currently used to measure the maximum displacement during the drop process, so as to judge whether the product is in direct contact with the ground. However, this method is limited by the fact that the clay can only be pasted until the product is not covered by packaging materials. The range may need to insert the straw into the packaging material, and only the maximum displacement can be obtained, but whether the packaging material can be attached to the product during the drop process, or whether the product is partially stressed due to the extrusion of the packaging material is unimportant. Cannot be quantified

Furthermore, the traditional clay and two-stage straw method can only be pasted to the gap between the packaging material and the product, and the compression direction of the clay and the two-stage straw must point to the outer packaging carton, which is not easy to use, and is affected by the geometric appearance of the product. limit

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