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Light emitting element

A technology of light-emitting components and components, applied in electrical components, semiconductor devices, circuits, etc., can solve problems such as light output drop, intrusion into the light-emitting layer, crystal defect ion species, etc.

Inactive Publication Date: 2015-06-17
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, when a dry etching method is used, crystal defects are easily caused on the treated area and ion species sometimes invade into the light emitting layer
As a result, the light output sometimes drops during longer operating times

Method used

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  • Light emitting element
  • Light emitting element
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Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0016] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0017] Figure 1A is a schematic plan view of the light emitting element according to the first embodiment of the present invention, and Figure 1B is a schematic cross-sectional view at line A-A.

[0018] The light emitting element includes a substrate 10 , a stacking body 32 disposed on the substrate 10 , a first electrode 50 disposed on the stacking body 32 , and a second electrode 13 disposed on the rear surface of the substrate 10 .

[0019] The stacked body 32 has a light emitting layer 22 , a first conductivity type layer 30 disposed on the light emitting layer 22 , and a second conductivity type layer 18 disposed below the light emitting layer 22 . The first conductivity type layer 30 includes the cladding layer 24 on one surface side of the light emitting layer 22 , the current spreading layer 26 , the second layer 25 and the contact layer 28 . In addition, t...

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PUM

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Abstract

According to one embodiment, a light emitting element includes a light emitting layer, a cladding layer, a current spreading layer, a second layer, and an electrode. The light emitting layer is capable of emitting emission light. The current spreading layer includes a surface processed layer and a first layer. The surface processed layer has a surface including convex portions and bottom portions provided adjacent to the convex portions. The first layer is provided between the surface processed layer and the cladding layer. The second layer is provided between the surface processed layer and the cladding layer and includes a region having an impurity concentration higher than an impurity concentration of the current spreading layer. The electrode is provided in a region of the surface of the surface processed layer where the convex portions and the bottom portions are not provided.

Description

[0001] Cross References to Related Applications [0002] This application is based on and claims priority from the following application: Prior Japanese Patent Application No. 2010-246409 filed on November 2, 2010; the entire contents of which are incorporated by reference. technical field [0003] Embodiments described herein generally relate to light emitting elements. Background technique [0004] For applications in lighting equipment, display devices, traffic lights, etc., there is an increasing need for light emitting elements to have higher outputs. [0005] When the high-concentration current spreading layer is disposed between the light emitting layer and the electrode, carriers injected from the electrode are spread in the plane of the light emitting layer and higher light output is easily emitted. [0006] In addition, when the minute concave-convex structure is formed on the surface of the current diffusion layer on the light emitting side, the light extraction ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/02H01L33/14
CPCH01L33/14H01L33/22
Inventor 片冈敬西川幸江山崎宏德
Owner KK TOSHIBA