Manufacturing method of interconnection structure

Abstract

The invention provides a manufacturing method of an interconnection structure. The method comprises: a substrate is provided as well as a first substrate pad and a first conductive projection are successively formed on the substrate; a first insulating dielectric layer that is flush with the first conductive projection is formed; a conducting layer is formed on the first insulating dielectric layer; the conducting layer is etched to form an opening of the conducting layer; an insulating mask layer is formed on the conducting layer and an opening of the mask layer is formed in the insulating mask layer, wherein the opening of the mask layer enables the first conductive projection below the opening and a portion of the residual conducting layer to be exposed; an electroplating deposition technology is carried out and a second substrate pad is formed in the opening of the mask layer; the insulating mask layer and a portion of the conducting layer are removed, wherein the portion of the conducting layer is not covered by the second substrate pad; and a second insulating dielectric layer is formed on the substrate, wherein the second insulating dielectric layer is flush with the secondsubstrate pad. According to the invention, reliability of an interconnection structure of a printed circuit board can be improved.

Description

technical field [0001] The invention relates to a printed circuit board, in particular to a manufacturing method of the interconnection structure of the printed circuit board. Background technique [0002] In recent years, the design of various electronic products has become increasingly light, thin, short, and small. Therefore, various electronic components or printed circuit boards for mounting electronic components also need to be relatively miniaturized and lightweight. The requirement for high density of printed circuit board (PCB) is also increasing day by day. In the prior art, wiring layers are stacked into multiple layers to form a high-density printed wiring board. [0003] A conventional manufacturing method of a multilayer high-density printed circuit board is a deposition method, that is, an insulating dielectric layer is usually deposited on a substrate provided with a wiring layer, and then another wiring layer is deposited on the insulating dielectric layer....

AI Technical Summary

Problems solved by technology

[0016] In practice, it is found that the reliability of printed circuit boards produced by existing methods cannot meet the requirements, and the performance of electrical signal transmission is not good.

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