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A kind of conductive film mold and its production method and conductive film

A production method and technology of conductive film, applied in the direction of equipment for manufacturing conductive/semiconductive layer, cable/conductor manufacturing, conductive layer on insulating carrier, etc., can solve problems such as open circuit, conductive material is easy to fall off, etc., to prevent Open circuit phenomenon, effect of increasing adhesion

Active Publication Date: 2022-07-08
SUZHOU WEIYEDA TOUCH TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, most of the conductive films produced by conductive film molds have smooth groove bottoms. After filling conductive materials, the conductive materials (such as silver) are easy to fall off, resulting in open circuits.

Method used

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  • A kind of conductive film mold and its production method and conductive film
  • A kind of conductive film mold and its production method and conductive film
  • A kind of conductive film mold and its production method and conductive film

Examples

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Embodiment Construction

[0026] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and embodiments. The following examples are intended to illustrate the present invention, but not to limit the scope of the present invention.

[0027] Please refer to Figure 1 to Figure 2 , the manufacturing method of the conductive film mold provided in the embodiment of the present invention, the specific steps of the method include:

[0028] S1: provide a substrate;

[0029] S2: Treat the surface on one side of the substrate to form a rough surface;

[0030] S3: Coat a layer of photoresist on the rough surface to form a photoresist layer;

[0031] S4: making a conductive layer pattern with a conductive film on the photoresist layer and a groove with a rough bottom surface;

[0032] S5: Provide a substrate, transfer the grooves with rough bottom surfaces to the substrate to obtain a conductive film mold with protrusions correspo...

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PUM

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Abstract

The invention discloses a method for manufacturing a conductive film mold, comprising: S1: providing a glass substrate; S2: treating the surface of one side of the glass substrate to form a rough surface; S3: coating a photoresist layer on the rough surface; S4: A conductive layer pattern with a conductive film and grooves with a rough bottom surface are fabricated on the photoresist layer; S5: Provide a substrate, and transfer the grooves with a rough bottom surface to the substrate to obtain a conductive film with protrusions Mold, the protrusions correspond to the grooves and the top surface of the protrusions is rough. The invention also discloses a conductive film mold, which comprises a base layer, a protrusion with a conductive layer pattern of the conductive film arranged on the base layer, and the top surface of the protrusion is rough. The invention also discloses a conductive film, comprising a base layer and a conductive layer, the base layer is provided with a groove with a rough bottom surface, and the conductive layer is embedded in the groove. Through the protrusions with rough surfaces, the fabricated conductive film has grooves with rough groove bottoms, thereby increasing the adhesion of the conductive material filled in the grooves.

Description

technical field [0001] The present invention relates to the technical field of conductive film mold manufacturing, in particular to a conductive film mold, a method for making the same, and a conductive film. Background technique [0002] More and more electronic devices such as mobile phones and tablet computers use touch screens. As a new type of input device, touch screens have become very popular and common, and the demand for conductive films, which are indispensable for touch screens, is also increasing. Therefore, in order to meet the requirements of the conductive film, a conductive film mold is used to assist in the production of the conductive film, which is beneficial to the mass production of the conductive film. [0003] In the prior art, most of the conductive films produced by conductive film molds have smooth groove bottoms. After the conductive material is filled, the conductive material (such as silver) tends to fall off, resulting in an open circuit. It i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B5/14H01B13/00G06F3/041
CPCH01B5/14H01B13/0026G06F3/041
Inventor 刘麟跃基亮亮周小红
Owner SUZHOU WEIYEDA TOUCH TECH
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