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Arrangement with chip and carrier

A chip and carrier technology, applied in the direction of electrical solid devices, semiconductor devices, semiconductor/solid device components, etc., can solve surface sensitivity and other problems, achieve efficient cooling, reduce fracture risk, and good thermal conductivity

Inactive Publication Date: 2012-05-23
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is not possible to press the chip down too much as the chip is quite fragile and the surface may be sensitive due to air-bridges at the gate area on the chip

Method used

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  • Arrangement with chip and carrier
  • Arrangement with chip and carrier
  • Arrangement with chip and carrier

Examples

Experimental program
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Embodiment Construction

[0039] will now refer to figure 1 describe the invention, figure 1 An arrangement A is shown comprising a chip 1 and a carrier 2 for the chip, wherein the chip 1 is adapted to be attached to a contact surface 21 on the carrier 2 by means of an adhesive member 3 . The figure also shows the ground pad 12 belonging to the chip 1 .

[0040] It should be understood that the figures are merely simplified representations of the invention, in which dimensions do not necessarily correspond to those of real components.

[0041] The invention specifically teaches the feature of placing a ridge 4 between the chip 1 and the carrier 2 , wherein the ridge 4 serves to increase the thermal contact between the chip 1 and the carrier 2 . This increased thermal contact is achieved by the much smaller distance between the chip 1 and the carrier 2 in the area of ​​the ridge 4 when the chip is attached to the carrier. A perhaps surprising example feature thus achieved is that thermal conductivity...

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PUM

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Abstract

Chip (1) and a carrier (2) of the chip are disclosed, where a ridge (4) is positioned between the chip (1) and the carrier (2), which ridge (4) is adapted to increase the thermal contact between the chip (1) and the carrier (2). Example 5 use is attachment to a contact surface (21) on the carrier (2) by means of an adhesive member (3).

Description

technical field [0001] The invention relates to an arrangement comprising a chip and a chip carrier, wherein the chip is adapted to be attached to a contact surface on the carrier by means of adhesive means. The present invention also relates to a chip in the inventive arrangement and a carrier in the inventive arrangement. Background technique [0002] The power amplifier chip (PA chip) is mostly attached at its carrier by some 20 μm to 100 μm silver epoxy adhesive. This is not ideal because of the low thermal conductivity of silver epoxy adhesives, typically in the range of 7 to 65 Watts / meter Kelvin (Celsius) (Wm-1K-1) depending on the type. This should be compared to 380Wm-1K-1 for copper, 290Wm-1K-1 for gold, and 420Wm-1K-1 for silver. One of the reasons the bond line is thick is because the chip "floats" on the adhesive. [0003] A general way to solve the problem of increasing the thermal conductivity of the adhesive used to attach the chip to the carrier is to inc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/24H01L23/485
CPCH01L23/367H01L23/36H01L2924/0002H01L2924/00
Inventor 雷夫·贝里斯泰特
Owner HUAWEI TECH CO LTD