Process for manufacturing diffusion coating prevention PCB (printed circuit board) gold-plated board

Abstract

The invention belongs to the field of manufacturing of a PCB (printed circuit board) board and provides a process for manufacturing a diffusion coating prevention PCB gold-plated board. The process comprises the following steps of: firstly, removing a dry film on a copper-clad plate besides a circuit graph; then etching to remove a copper region covered by the dry film besides the circuit graph; removing dry film on the circuit graph and exposing the copper region of the circuit graph; making a gold-clad wire in the copper region of the circuit graph; and finally, powering on the gold-clad wire, plating gold in the copper region of the circuit graph and etching to remove the gold-clad wire after completing gold plating so as to obtain the diffusion coating prevention PCB gold-plated board. Compared with the existing process, the process has the advantages that firstly, the dry film on the copper-clad plate is totally removed, and then gold is plated in the copper region of the circuit graph; and the dry film does not exist in the process of plating gold, so that the condition that medicinal liquid penetrates into the dry film in the process of plating gold cannot occur, the diffusion coating problem of the existing process is completely solved, and the yield of the PCB gold-plated board is obviously improved.

Description

technical field [0001] The invention belongs to the field of PCB board manufacturing, and more specifically relates to a PCB gold-plated board manufacturing process of anti-seepage plating. Background technique [0002] At present, the main process flow of PCB board gold plating is: [0003] (1) Set up a copper clad board, and paste a layer of dry film on the entire surface of the copper clad board; [0004] (2) Developing: develop the dry film on the part to be gold-plated, exposing the copper surface; [0005] (3) gold plating: plate a gold layer on the exposed copper surface in step (2); [0006] (4) Remove the undeveloped dry film by etching process to expose the copper surface; [0007] (5) Etching away the exposed copper surface in step (4). [0008] In step (3) of the above-mentioned PCB board gold plating process, due to the boundary between the undeveloped dry film and the area to be gold-plated, the adhesion of the dry film is not good, and the liquid medicine ...

AI Technical Summary

Problems solved by technology

[0008] In step (3) of the above-mentioned PCB board gold plating process, due to the boundary between the undeveloped dry film and the area to be gold-plated, the adhesion of the dry film is not good, and the liquid medicine will penetrate into the dry film during gold plating, making the coating The place where gold plating is not needed on the copper board is permeated with gold, which leads to the scrapping of the gold-plated PCB