Printed circuit board
A technology for printed circuit boards and substrates, applied in the direction of printed circuit components, etc., can solve the problems of uneven material of printed circuit boards, poor wiring at the corners of the traces, affecting the quality of signal transmission, etc., so as to improve signal quality and eliminate weaving. effect, the effect of reducing the loss
Inactive Publication Date: 2012-06-06
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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Problems solved by technology
[0002] At present, the substrates of many printed circuit boards are woven from glass fiber mixed resin materials. However, due to the different density of the glass fiber mixed resin after weaving, the material of each section of the printed circuit board will be uneven. That is, the fiber-weave effect is formed, which will affect the quality of signal transmission
A common method for improving the weaving effect is the Zig-zag routing design, but the existing Zig-zag routing design sometimes takes up too much wiring due to the excessive rotation angle (usually greater than 10 degrees, generally 11.3 degrees) The space may lead to poor wiring at the turn of the wiring, so how to design a better glyph winding design is a problem that the industry needs to solve
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[0015] Please refer to figure 1 , the printed circuit board 100 of the present invention is a printed circuit board whose substrate is woven from a glass fiber mixed resin material, and its preferred embodiment includes a signal layer 10 on which a forward differential signal line 12 and A negative differential signal line 14 . The printed circuit board 100 may also include other layers, and the signal layer 10 may also include other data traces, which are not shown in the figure because they do not involve technical points.
[0016] In order to eliminate the influence of the weaving effect on signal transmission, the positive differential signal line 12 and the negative differential signal line 14 are designed by the zigzag winding method, that is, the positive differential signal line 12 is placed on the signal layer 10 and along the wiring direction. and the negative differential signal line 14 are wired in the shape of a triangular wave. The wiring design of the positive...
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The invention relates to a printed circuit board which comprises a signal layer. The signal layer is provided with a positive differential signal wire and a negative differential signal wire which are arranged in parallel. Both the positive differential signal wire and the negative differential signal wire are arranged by adopting a Zig-zag routing method. The ratio of the vertical distance from the topmost point to the lowermost point of each differential signal wire to the distance of the adjacent topmost point and lowermost point in the wire arrangement direction is 1:7. After the printed circuit board is adopted, the wire arrangement space can be saved and the wire arrangement flexibility is improved.
Description
technical field [0001] The invention relates to a printed circuit board. Background technique [0002] At present, the substrates of many printed circuit boards are woven from glass fiber mixed resin materials. However, due to the different density of the glass fiber mixed resin after weaving, the material of each section of the printed circuit board will be uneven. That is to form a fiber-weave effect (Fiber-weave Effect), which will affect the quality of signal transmission. A common method for improving the weaving effect is the Zig-zag routing design, but the existing Zig-zag routing design sometimes takes up too much wiring due to the excessive rotation angle (usually greater than 10 degrees, generally 11.3 degrees) The space may lead to poor wiring at the turn of the wiring, so how to design a better glyph winding design is a problem that the industry needs to solve. Contents of the invention [0003] In view of the above, it is necessary to provide a printed circu...
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IPC IPC(8): H05K1/02
Inventor 赖盈佐陈永杰陈嘉琪
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD