Modularized vacuum adsorption curve type thin plate element conveying device

A technology of vacuum adsorption and handling device, which is used in transportation and packaging, object supply, thin material processing, etc., to achieve the effect of simple structure and convenient application.

Inactive Publication Date: 2012-06-13
HOHAI UNIV CHANGZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In order to solve the problem that the vacuum adsorption plate handling device in the prior art cannot be well adapted to different curvature changes, different w

Method used

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  • Modularized vacuum adsorption curve type thin plate element conveying device
  • Modularized vacuum adsorption curve type thin plate element conveying device
  • Modularized vacuum adsorption curve type thin plate element conveying device

Examples

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Example Embodiment

[0019] The present invention will be further described below in conjunction with the drawings.

[0020] Such as Figure 1-6 As shown, a modular vacuum suction curved-surface thin-plate part conveying device includes a top plate 1, a beam 2, a cylinder assembly module 3, a top plate expansion module 4, a beam expansion module 5 and a hook 6. The top plate 1 is equipped with guide rails 1-1, and both sides of the top plate are slotted for the top plate expansion module 4; the crossbeam 2 is equipped with guide rails 2-1, and the crossbeam 2 has grooves on both sides to install the crossbeam expansion assembly 5; cylinder assembly Module 3 mainly includes cylinder 3-1, universal joint 3-2, vacuum suction joint 3-3, suction cup 3-4, guide groove 3-5 and piston rod 3-6. A universal joint 3-2 is provided at the bottom of the piston rod 3-6. The universal joint 3-2 is connected to the suction cup 3-4 at the bottom. The suction cup 3-4 is connected to the vacuum pipeline of the vacuum e...

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Abstract

The invention discloses a modularized vacuum adsorption curve type thin plate element conveying device, which comprises a top plate, a cross beam and an air cylinder assembly module and is characterized in that a plurality of guide rails are arranged on the top plate, the cross beam extends into the corresponding front and back guide rails and can move along the front and back guide rails, left and right guide rails are arranged on the cross beam, the bottom of an air cylinder piston rod of the air cylinder assembly module is provided with a universal joint, the universal joint is connected with a suction disc arranged at the bottom of the universal joint, the suction disc is connected with a vacuum pipeline of vacuum equipment through a vacuum adsorption joint, guide rail grooves are connected into the air cylinder side wall, and the air cylinder assembly module is connected with the left and right guide rails through the guide rail grooves and can move along the left and right guide rails. The problem that the vacuum adsorption plate element conveying device in the prior art cannot be perfectly applicable to plate elements with different curvature variations, different wall thicknesses and different weight series is solved by the modularized vacuum adsorption curve type thin plate element conveying device, and the modularization-based vacuum absorption curve type thin plate element conveying device capable of being expanded and regulated according to actual use conditions is provided.

Description

technical field [0001] The invention relates to a material handling device, in particular to a modularized vacuum adsorption curved surface thin plate piece handling device. Background technique [0002] At present, most of the thin-plate parts handling devices commonly used in domestic and foreign enterprises adopt the slide rail conveying method. The foundation of the device needs to be installed and fixed on the ground, which often occupies a large proportion of the factory building area and fails to make full use of the factory building space. At present, many manufacturers have begun to use vacuum adsorption-type plate handling devices. However, most of the devices are fixed structures and have poor adaptability. They are mainly suitable for relatively flat plates with large wall thickness. In the handling of some complex curved thin plate parts, the existing handling devices have the following problems: 1. The thin plate part will be deformed under the influence of gra...

Claims

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Application Information

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IPC IPC(8): B65H5/22
Inventor 张洪双
Owner HOHAI UNIV CHANGZHOU
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