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Modularized vacuum adsorption curve type thin plate element conveying device

A technology of vacuum adsorption and handling device, which is used in transportation and packaging, object supply, thin material processing, etc., to achieve the effect of simple structure and convenient application.

Inactive Publication Date: 2012-06-13
HOHAI UNIV CHANGZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In order to solve the problem that the vacuum adsorption plate handling device in the prior art cannot be well adapted to different curvature changes, different wall thicknesses and different weight series of plates, the present invention provides a Expanded and adjusted vacuum adsorption curved surface thin plate handling device

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  • Modularized vacuum adsorption curve type thin plate element conveying device
  • Modularized vacuum adsorption curve type thin plate element conveying device
  • Modularized vacuum adsorption curve type thin plate element conveying device

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Embodiment Construction

[0019] The present invention will be further described below in conjunction with the accompanying drawings.

[0020] Such as Figure 1-6 As shown, a modularized vacuum adsorption curved surface thin plate handling device includes a roof 1 , a beam 2 , a cylinder assembly module 3 , a roof extension module 4 , a beam extension module 5 and a hook 6 . The top plate 1 is equipped with guide rails 1-1, and there are grooves on both sides of the top plate, which are used for the top plate expansion module 4; Module 3 mainly includes cylinder 3-1, universal joint 3-2, vacuum adsorption joint 3-3, suction cup 3-4, guide rail groove 3-5 and piston rod 3-6. A universal joint 3-2 is arranged at the bottom of the piston rod 3-6, the universal joint 3-2 is connected with the suction cup 3-4 at the bottom, and the suction cup 3-4 is connected to the vacuum pipeline of the vacuum equipment through the vacuum adsorption joint 3-3 The side wall of the cylinder 3-1 is connected with a guide ...

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Abstract

The invention discloses a modularized vacuum adsorption curve type thin plate element conveying device, which comprises a top plate, a cross beam and an air cylinder assembly module and is characterized in that a plurality of guide rails are arranged on the top plate, the cross beam extends into the corresponding front and back guide rails and can move along the front and back guide rails, left and right guide rails are arranged on the cross beam, the bottom of an air cylinder piston rod of the air cylinder assembly module is provided with a universal joint, the universal joint is connected with a suction disc arranged at the bottom of the universal joint, the suction disc is connected with a vacuum pipeline of vacuum equipment through a vacuum adsorption joint, guide rail grooves are connected into the air cylinder side wall, and the air cylinder assembly module is connected with the left and right guide rails through the guide rail grooves and can move along the left and right guide rails. The problem that the vacuum adsorption plate element conveying device in the prior art cannot be perfectly applicable to plate elements with different curvature variations, different wall thicknesses and different weight series is solved by the modularized vacuum adsorption curve type thin plate element conveying device, and the modularization-based vacuum absorption curve type thin plate element conveying device capable of being expanded and regulated according to actual use conditions is provided.

Description

technical field [0001] The invention relates to a material handling device, in particular to a modularized vacuum adsorption curved surface thin plate piece handling device. Background technique [0002] At present, most of the thin-plate parts handling devices commonly used in domestic and foreign enterprises adopt the slide rail conveying method. The foundation of the device needs to be installed and fixed on the ground, which often occupies a large proportion of the factory building area and fails to make full use of the factory building space. At present, many manufacturers have begun to use vacuum adsorption-type plate handling devices. However, most of the devices are fixed structures and have poor adaptability. They are mainly suitable for relatively flat plates with large wall thickness. In the handling of some complex curved thin plate parts, the existing handling devices have the following problems: 1. The thin plate part will be deformed under the influence of gra...

Claims

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Application Information

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IPC IPC(8): B65H5/22
Inventor 张洪双
Owner HOHAI UNIV CHANGZHOU
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