Tension adjusting mechanism for copper foil surface treating machine

Abstract

The invention relates to a tension adjusting mechanism for a copper foil surface treating machine; an upper bracket is fixed on the upper surface of a lower bracket; a guide roller is arranged in the middle of the upper surface of the lower bracket; a counterweight roller is positioned at one side of a tension adjusting roller and below the longitudinal beam of the lower bracket; the counterweight roller is hung at one end of a steel wire rope by virtue of fixed pulleys; the tension adjusting roller is positioned at the other side of the counterweight roller and above the longitudinal beam of the lower bracket; the tension adjusting roller is arranged on guide rod fixing seats positioned on the upper surface of the lower bracket; the pair of fixed pulleys are respectively arranged on the upper surface of a longitudinal beam of the upper bracket; the pair of guide rod fixing seats are respectively positioned on the upper surface of the lower bracket and the lower surface of the longitudinal beam of the upper bracket; and the positions of the two guide rod fixing seats correspond to each other. The tensile force generated by the gravity of a counterweight block is direct, and a copper foil is ensured to be tensioned since the change of the tensile force generated by the instant relaxation and tension of the copper foil can be made up by the movement of the tension adjusting roller at any time, so that the tensile force of the rolled copper foil is guaranteed to be constant. The tension adjusting mechanism has the characteristics of being simple in processing and installing as well as simple and convenient to operate, control and use.

Description

technical field [0001] The invention relates to a component of copper foil surface treatment equipment, in particular to a tension adjustment mechanism that adjusts the tension through the instantaneous movement of a tension adjustment roller to ensure that the tension of copper foil winding is constant and flat. Background technique [0002] Electrolytic copper foil is one of the basic materials in the electronics industry. In addition to being used in bypass busbars, radio wave shielding plates, high-frequency busbars and heat collectors, more than 90% of it is used to manufacture printed circuit boards and transmit electrical signals. [0003] Electrolytic copper foil is currently the main manufacturing method for copper foil used in the electronics industry. The method is to use the principle of electrochemistry, and under the action of the supporting system, a certain concentration of electrolyte is sent into the foil machine. After obtaining two electrons, copper atom...

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Problems solved by technology

[0011] In order to overcome the problems existing in the prior art that cannot meet the requirement of constant tension at any time, resulting in smooth winding and un...

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