Silicon chip taking and placing device

Abstract

The invention relates to a silicon chip taking and placing device. A sucking disc is fixed on a connecting seat, a plurality of air holes are formed in the sucking disc, and a concave cavity is formed in the connecting seat; a lower end cover is fixed on the connecting seat, and a lower vent hole is formed in the center of the lower end cover and communicated with the concave cavity; a valve body is fixed on the lower end cover, an annular air inlet cavity is formed in the valve body, a middle vent hole is formed in the center of the valve body, the annular air inlet cavity is isolated from the middle vent hole through an annular wall, and an air inlet gap is reserved between the bottom part of the annular wall and the top part of the lower end cover; an upper end cover is fixed on the valve body, an upper vent hole is formed in the center of the lower part of the upper end cover, and at least two oblique exhaust holes are formed in the upper part of the upper end cover; a first joint is connected to one side of the valve body and is communicated with the annular air inlet cavity in the valve body; and a second joint is connected to the other side of the valve body and is communicated with the concave cavity in the connecting seat through a second air inlet passage. The silicon chip taking and placing device disclosed by the invention is skilful and reasonable in structure, and can not influence the positions of silicon chips beside a sucked silicon chip when sucking and releasing the silicon chip.

Description

technical field [0001] The invention belongs to the technical field of solar silicon wafer production, and in particular relates to a device for taking and placing silicon wafers during the production process of solar silicon wafers. Background technique [0002] In the production process of solar silicon wafers, silicon wafers need to be transported on different conveying mechanisms. Most of the silicon wafer pick-and-place devices commonly used now are suction-type. The structure of the previous silicon wafer picking and placing device is as follows: Figure 4 As shown, it is mainly composed of a concave block 11, a sealing ring 12, a convex block 13, a joint 14 and a sensor 15, and the compressed air enters through the joint 14, and the compressed air passes through the gap between the concave block 11 and the convex block 13 to the surrounding at high speed. Discharging, so that a local vacuum negative pressure is generated directly under the bump 13, thereby sucking th...

AI Technical Summary

Problems solved by technology

The structure of the previous silicon wafer picking and placing device is as follows: Figure 4 As shown, it is mainly composed of a concave block 11, a sealing ring 12, a convex block 13, a joint 14 and a sensor 15, and the compressed air enters through the joint 14, and the compressed air passes through the gap between the concave block 11 and the convex block 13 to the surrounding at high speed. Discharging, so that a local vacuum negative pressure is generated directly under the bump 13, thereby sucking the silicon wafer 16 below the bump 13. The shortcoming of this device is: because this device generates a high-speed airflow between the bump 13 and the concave block 11, When the high-speed air flow is discharged, it will blow to the silicon wafer next to the sucked silicon wafer, thereby changing the position of the silicon wafer next to it and affecting the production process of the silicon wafer

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