Solder resist manufacturing method of thick copper plate
A production method and technology for thick copper plates, which are used in the solder mask production of thick copper plates. In the field of solder mask production of 4OZ PCB boards, it can solve the problems of inconsistent thickness of line and corner ink, and achieve uniformity and consistency, and increase the thickness. Effect
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[0022] To illustrate the idea and purpose of the present invention, the present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0023] The present invention provides a method for making thick copper plates for solder resist. By first performing wire corner silk screen printing and then performing circuit surface silk printing, it solves the problem of the current thick copper plate solder resist manufacturing using secondary silk printing or spraying. The problem of inconsistency between the thickness of the surface ink and the thickness of the line angle ink.
[0024] See figure 1 , figure 2 As shown, figure 1 It is a schematic diagram of the cross-sectional structure of the circuit board of the present invention for line corner silk screen printing through the screen; figure 2 It is a schematic diagram of the screen printing effect of the line angle of the circuit board of the present invention. The thick coppe...
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