Epoxy resin composition for encapsulating semiconductor device and semiconductor device using the same
A technology of epoxy resin and composition, applied in the direction of semiconductor/solid-state device parts, semiconductor devices, semiconductor/solid-state device manufacturing, etc., can solve the problem of fluidity, dispersion and reactivity reduction, deterioration of moldability and processability, etc. question
Inactive Publication Date: 2012-07-04
CHEIL IND INC
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- Description
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Problems solved by technology
However, although this method ensures flame retardancy and reliability, the inorganic filler causes a sharp decrease in fluidity, dispersibility and reactivity, thereby deteriorating formability and processability
Method used
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Embodiment 1 to 6
[0105] The composition was prepared according to the composition listed in Table 1, and uniformly mixed using a Henschel mixer to prepare a preliminary powder product. The product was melt-kneaded at a maximum temperature of 110° C. using a twin-screw kneader, then cooled and pulverized, thereby producing an epoxy resin composition for encapsulating a semiconductor device.
[0106] The physical properties and reliability of the epoxy resin composition were evaluated as follows. The test results of properties, flame retardancy, reliability and moldability of each epoxy resin composition are given in Table 3.
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Abstract
The invention discloses an epoxy resin composition for encapsulating a semiconductor device, a method of encapsulating a semiconductor device, and a semiconductor device, the composition including an epoxy resin; a curing agent; a curing accelerator; an inorganic filler; and a flame retardant; wherein the flame retardant includes boehmite, and is present in an amount of about 0.1 to 20% by weight (wt %), based on a total weight of the epoxy resin composition. The epoxy resin composition displays excellent fire retardancy and enough moulding and reliability, and a fire retardant compound generating a by-product harmful upon the human body and environment during combustion is not needed. [Formula 1] A1O (OH).
Description
technical field [0001] The present invention relates to an epoxy resin composition for encapsulating a semiconductor device and a semiconductor device using the same. More particularly, the present invention relates to an epoxy resin composition for encapsulating a semiconductor device having excellent flame retardancy and a semiconductor device using the same. Background technique [0002] In general, epoxy resin compositions used for encapsulating semiconductor devices require UL94 flammability conforming to V0. Flammability can be determined based on the UL94 standard of Underwriters Laboratories. The UL94 test is carried out according to ASTM D635 in the United States, and the V level of the sample can be determined based on the implementation of burning cotton, burning time, luminous time and burning degree. [0003] In order to impart flame retardancy to epoxy resin compositions for encapsulating semiconductor devices, brominated epoxy resins or antimony trioxide (Sb...
Claims
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IPC IPC(8): C08L63/02C08K3/22C08K3/36H01L21/56H01L23/29C09K3/10
CPCC08K3/22H01L23/296C08L63/00C08G59/688H01L23/295C08G59/621H01L2924/0002H01L2924/00
Inventor 李映均李殷祯裴庆徹
Owner CHEIL IND INC