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A cavityless dual-interface smart card carrier tape

A dual-interface, intelligent technology, applied in the direction of electric solid-state devices, semiconductor devices, recording carriers used by machines, etc., can solve the problems of high production cost, poor versatility, complex production process, etc., and achieve high versatility, good practicability, The effect of reducing production costs

Active Publication Date: 2018-01-16
SHANGHAI CHANGFENG SMART CARD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The present invention aims at the problems of poor versatility, complex production process and high production cost caused by the need for a dedicated chip placement cavity in the existing carrier tape, and provides a cavity-less dual-interface smart card carrier tape

Method used

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  • A cavityless dual-interface smart card carrier tape
  • A cavityless dual-interface smart card carrier tape
  • A cavityless dual-interface smart card carrier tape

Examples

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Embodiment Construction

[0031] In order to make it easy to understand the technical means, creative features, objectives and effects achieved by the present invention, the present invention will be further explained below in conjunction with specific drawings.

[0032] The present invention addresses the problems of high energy consumption, cumbersome manufacturing process, and relatively poor reliability in use in the common production process of existing smart cards, and the specific implementation of the technical solution provided is as follows:

[0033] See Figure 1 to 4 The present invention provides a cavity-free dual-interface smart card carrier tape. The carrier tape includes a substrate layer 300 in the middle, and a contact surface 100 and a pad surface 200 respectively disposed on the upper and lower surfaces of the substrate layer.

[0034] For the chip carrying area on the carrier tape, the present invention forms the chip carrying area 301 directly on the surface of the substrate layer 300. ...

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Abstract

The invention discloses a dual-interface smart card carrier tape without a cavity, comprising a substrate layer, a contact surface and a welding pad surface. The contact surface and the welding pad surface are arranged on the upper surface and the lower surface of the substrate layer respectively. The dual-interface smart card carrier tape without a cavity further comprises a chip bearing area, and the chip bearing area is directly formed on the surface of the substrate layer. The chips of various specifications can be directly borne in the dual-interface smart card carrier tape without a cavity to realize the contact environment and the non-contact function. Most of the production equipment and process can be used without purchasing or designing new production equipment, thus the raw material cost, the production cost and the overall production time of the dual-interface smart card carrier tape without a cavity are greatly reduced.

Description

Technical field [0001] The invention relates to a microelectronic semiconductor packaging technology and an integrated circuit packaging technology, in particular to a carrier tape for a dual-interface smart card. Background technique [0002] With the continuous advancement of integrated circuit packaging technology, the integration of integrated circuits is increasing day by day, and the functions are becoming more and more abundant. For new application requirements, integrated circuit packaging companies are required to design new types of carriers to meet new needs. [0003] For example, in the field of financial card payment, the demand for dual-interface smart cards is very large. Users need smart cards to have contact functions to manage large amounts of funds, and they also need to use non-contact functions to make micro-fund payments. At present, the smart card industry is developing toward the route of technological innovation. New technologies are constantly emerging, ne...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/498G06K19/077
CPCH01L24/97H01L2924/14H01L2924/00
Inventor 杨辉峰蒋晓兰唐荣烨马文耀
Owner SHANGHAI CHANGFENG SMART CARD