Method, system and circuit board for making circuit board bumps

Abstract

The invention discloses a method and a system for manufacturing bumps on circuit boards and a circuit board utilizing the same, which relate to the field of manufacturing of circuit boards. The method for manufacturing bumps on the circuit boards includes: directly manufacturing bumps after circuits are manufactured and removing temporary films used in circuit manufacturing and removing temporary films used in bump manufacturing. Probability of production defects due to incomplete film removal can be decreased by removing films once, and meanwhile, during bump manufacturing, the temporary films used during circuit manufacturing is not removed, so that alignment during bump manufacturing is omitted, displacement tolerance of the bumps is the tolerance during circuit manufacturing, and manufacturing precision of the bumps of the circuit boards is increased.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to a method, system and circuit board for producing circuit board bumps. Background technique [0002] With the development of electronic products in the direction of lightness, thinness, shortness, smallness and multiple functions, new requirements are constantly put forward for electronic packaging. To meet this need, flip-chip (Flip-Chip) technology is Performance, high I / O pin count, package size reduction and other advantages are increasingly widely used. Flip-chip technology adopts chip-to-substrate bonded packaging. The packaging method is that the front of the chip faces the substrate without wire bonding. Compared with traditional wire connection and carrier tape connection, the obvious advantages of flip-chip technology include: the highest packaging density, It has good electrical and thermal performance, good reliability, and low cost. Therefore, flip chip techn...

AI Technical Summary

Problems solved by technology

The inventors of the present invention have found that, in view of the current conventional bump manufacturing method, two stripping processes need to be carried out during the fabrication process: respectively stripping the temporary film when making the circuit and stripping the temporary film when making the bump, It is also necessary to carry out the alignment process of bump graphics production, that is, to calibrate the position with the corresponding line gasket. The production process is cumbersome and the operation is complicated, which affects the accuracy of bumps.

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