Etching device and etching method

Abstract

An etching device comprises an etching groove, transfer roller groups, an upper spraying means, a lower spraying means, a first elevating mechanism and a second elevating mechanism. The transfer roller groups, the upper spraying means and the lower spraying means are arranged in the etching groove. The transfer roller groups comprise a plurality of upper transfer rollers and a plurality of lower transfer rollers. The upper spraying means is positioned above the plurality of the upper transfer rollers, and the lower spraying means is positioned below the plurality of the lower transfer rollers. The first elevating mechanism is installed in the etching groove, and is connected with the upper spraying means so as to drive the upper spraying means to move in a direction perpendicular to that of circuit board delivering, relative to the plurality of the upper transfer rollers. The second elevating mechanism is also installed in the etching groove, and is connected with the lower spraying means to drive the lower spraying means to move in a direction perpendicular to that of circuit board delivering, relative to the plurality of the lower transfer rollers. The invention further provides an etching method for etching circuit boards by means of the etching device.

Description

technical field [0001] The invention relates to etching technology, in particular to an etching device and an etching method. Background technique [0002] With the rapid development of the electronic industry, the manufacturing technology of circuit boards, which are the basic components of electronic products, is becoming more and more important. The circuit board is generally made of a copper-clad substrate through a series of processes such as cutting, drilling, copper plating, exposure, development, etching, pressing, printing, and molding. For details, please refer to the article "Dielectric characterization of printed circuit board substrates" published by C.H.Steer et al. in Proceedings of the IEEE, Vol.39, No.2 (August 2002). [0003] Among them, etching is an important manufacturing process of circuit board production, which mainly uses an etching device to selectively etch the copper foil layer on the surface of the circuit board to form circuit patterns. The ex...

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Problems solved by technology

However, since the distance between the upper and lower nozzles and the circuit board is fixed, when the copper foil layers on the upper and lower sides of the circuit board need to etch the circuit patterns of different line widths formed, especially on the upper and lower sides of the circuit board When the copper foil layers on both sides have different thicknesses, only by adjusting the spray pressure of the etching solution sprayed by the upper and lower nozzles and adjusting the speed of the conveying roller group to convey the circuit board, the circuit pattern with the required line width cannot be obtained.

To solve this problem, there are mainly two existing methods: one is to adjust the spray pressure and transmission speed by sacrificing the quality of the line pattern on a certain side. It will cause the line width of the line pattern on the other side to become thicker or the etching is insufficient to cause a short circuit; the second is to etch the line pattern on the first side first, and then form the line pattern on the other side after etching. Membranes and make the process cumbersome, thus increasing the cost

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