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Radiator

A heat sink and airflow channel technology, which is applied in the field of heat dissipation devices for power devices, can solve problems such as not being able to meet the requirements of complete machine assembly, and achieve the effects of fast heat dissipation, uniform temperature distribution, and large heat dissipation

Inactive Publication Date: 2012-07-11
SICHUAN JIUZHOU OPTOELECTRONIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] When power device radiators are required to have a better heat dissipation effect, especially for radiators of power devices assembled in groups, the existing technology still adopts the method of increasing the heat dissipation area, or giving forced air cooling, although it can Meet the heat dissipation requirements, but often cannot meet the requirements of the whole machine assembly

Method used

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Embodiment Construction

[0018] According to the accompanying drawings, a radiator of the present invention includes an upper end face 1, a lower end face 4, and an air flow channel between the two end faces fixedly connected to form an integral body.

[0019] according to figure 1 , figure 2 , image 3 , Figure 4 , the radiator is rectangular, and the parallel airflow passages on one opposite side communicate with each other and are perpendicular to the parallel airflow passages on the other opposite side. The cross section of the airflow passage can be notch-shaped, rectangular, regular polygonal or circular.

[0020] according to Figure 5 , Image 6 , the radiator is circular, and the airflow passages parallel to the diameter of the radiator on one opposite side communicate with each other and are perpendicular to the parallel airflow passages on the other opposite side. The cross section of the airflow passage can be notch-shaped, rectangular, regular polygonal or circular shape.

[0021]...

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Abstract

The invention relates to a radiator of a power device, in particular to the radiator used for a ganged power device. The radiator comprises an upper end surface, a lower end surface and air flow channels between the two end surfaces, the upper end surface, the lower end surface and the air flow channels are fixedly connected into a whole, the air flow channels are vertical to the end surfaces, and the air flow channels of different end surfaces are mutually communicated. The radiator introduces natural air for cooling and has the characteristics of quick radiation speed, large radiation amount, high radiating effect and uniform temperature distribution.

Description

Technical field: [0001] The invention relates to a cooling device for power devices, in particular to a radiator for grouped power devices. Background technique: [0002] When power device radiators are required to have a better heat dissipation effect, especially for radiators of power devices assembled in groups, the existing technology still adopts the method of increasing the heat dissipation area, or giving forced air cooling, although it can It meets the heat dissipation requirements, but often cannot meet the requirements of the whole machine assembly. Invention content: [0003] The object of the present invention is to provide a heat sink for grouped power devices to solve the defects and deficiencies of the above-mentioned prior art. [0004] The present invention can be realized by the following technical means: [0005] A radiator of the present invention comprises an upper end surface, a lower end surface and an airflow channel between the two end surfaces f...

Claims

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Application Information

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IPC IPC(8): H01L23/367H01L23/36
Inventor 刘国祥江新华刘德福
Owner SICHUAN JIUZHOU OPTOELECTRONIC TECH CO LTD