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Light-emitting diode illuminating device

A technology of light-emitting diodes and lighting devices, applied in lighting devices, cooling/heating devices of lighting devices, lighting and heating equipment, etc., can solve problems such as inability to meet large-angle lighting requirements, achieve large light irradiation range, and improve heat dissipation effect Effect

Inactive Publication Date: 2012-07-18
BENQ CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, its light irradiation range is approximately equal to 180 degrees, and this design cannot meet the lighting requirements of large angles.

Method used

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  • Light-emitting diode illuminating device

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Experimental program
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Effect test

Embodiment Construction

[0020] Such as Figure 2A and 2B In the preferred embodiment shown, the LED lighting device 800 of the present invention includes a heat conduction housing 100, a power drive circuit board 300, a heat conduction plate 500, an LED light source 700, a first insulated wire 910 and a second insulated wire 920. Preferably, the lampshade 200 forms an LED light bulb, but is not limited thereto. Wherein, the heat conduction shell 100 and the heat conduction plate 500 are preferably made of metal or alloy with good thermal conductivity, and the outer surface of the heat conduction shell 100 can be further provided with cooling fins 130 to increase the heat dissipation area to improve the heat dissipation effect.

[0021] Such as Figure 2B In the sectional view of the preferred embodiment shown, the heat conduction shell 100 encloses an inner space 110, and the inner space 110 has an opening 111, forming a hollow heat conduction shell. The power driving circuit board 300 is disposed...

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PUM

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Abstract

The invention relates to a light-emitting diode illuminating device, which comprises a heat conducting shell, a power driving circuit board, a heat conducting plate, a light-emitting diode light source, a first insulating lead and a second insulating lead. The heat conducting shell encircles to form an inner space provided with an opening. The power driving circuit board is disposed in the inner space, the heat conducting plate is provided with at least one through hole, and the opening is closed by the heat conducting plate. The light-emitting diode light source consists of a first light source electrode, a second light source electrode and a heat sink, and the heat sink is arranged on the bottom side of the light-emitting diode light source and welded on the outer surface of the heat conducting plate. The first insulating lead penetrates through the corresponding through hole, and the first light source electrode is coupled with the power driving circuit board via the first insulating lead. The second insulating lead penetrates through the corresponding through hole, and the second light source electrode is coupled with the power driving circuit via the second insulating lead.

Description

technical field [0001] The present invention relates to a light emitting diode lighting device, in particular to a light emitting diode bulb. Background technique [0002] Based on the characteristics of small size, low power consumption and long service life, the use of light-emitting diode (LED) bulbs has become more and more common. However, if the heat energy generated by the light emitting diode is not discharged in time, the temperature of the grain interface of the light emitting diode will be too high, thereby affecting the luminous efficiency and reducing the service life. Taking the current high-power light-emitting diodes as an example, the passing current can be as high as 330mA-1A, and the heat generated is astonishing. Therefore, when the power of the LED used in the LED light bulb increases, the heat dissipation problem needs to be solved urgently. [0003] Such as figure 1 As shown, the conventional LED light bulb 80 includes heat dissipation fins 10 , LED...

Claims

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Application Information

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IPC IPC(8): F21S2/00F21V29/00F21Y101/02F21K9/232F21K9/238F21V29/70F21V29/77F21V29/89F21Y115/10
Inventor 邹东兴
Owner BENQ CORP