Semiconductor manufacturing equipment-oriented logic coupling test method

Abstract

The invention provides a semiconductor manufacturing equipment-oriented logic coupling test method, which comprises the following steps of: generating a logic testing sequence according to a logic coupling relation of the semiconductor manufacturing equipment and a pre-set test requirement; serializing the logic testing sequence into an XML (Extensive Makeup Language) file so as to be stored; reading the XML file, and deserializing the XML file to obtain an operation object; loading the operation object and resolving the operation object; and sequentially carrying out corresponding test actions according to a resolving result so as to test the logic coupling relation of the semiconductor manufacturing equipment, wherein the test actions comprise command execution, waiting delay, condition judgment, logic sequence and command termination. According to the semiconductor manufacturing equipment-oriented logic coupling test method, the logic coupling relation in the equipment can be continuously and automatically tested, so that possible failures can be predicated and whether the equipment meets the standards or not can be detected.

Description

technical field [0001] The invention relates to the field of computer application technology and the field of integrated circuit equipment manufacturing technology, in particular to a logic coupling test method for semiconductor manufacturing equipment. Background technique [0002] Electronic information industry has developed into the first pillar industry of national economic and social development. The basic industry of the electronic information industry is the semiconductor manufacturing equipment industry. Today, my country's semiconductor manufacturing equipment industry is in a stage of rapid development. The integration level and chip functions of integrated circuit chips are constantly improving, and the requirements for technology are getting higher and higher. In order to ensure that the developed semiconductor manufacturing equipment meets the technical requirements, it is necessary to test the developed semiconductor manufacturing equipment and the system com...

AI Technical Summary

Problems solved by technology

For example, in the etching process, there are various process parameters in the reaction chamber, including temperature, pressure, vacuum degree, RF power source state, and impedance matching, etc. These process parameters interact with each other, and there is a complex coupling relationship

Therefore, before semiconductor manufacturing equipment and systems are put into use, it is necessary to test this complex logical coupling relationship to determine whether semiconductor manufacturing equipment and systems meet the requirements. However, different types of semiconductor manufacturing equipment and systems have different coupling relationships. , making it more difficult to test semiconductor manufacturing equipment and systems

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