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Polyimide adhesive

A polyimide and adhesive technology, applied in the direction of adhesives, etc., can solve the problems of strength reduction, viscosity reduction, poor toughness, etc., and achieve the effect of small changes in bonding strength and excellent heat resistance.

Inactive Publication Date: 2012-08-01
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problems of poor toughness of existing polyimide structural adhesives, and the problems of reduced viscosity and reduced strength during storage, and provide a polyimide adhesive and its preparation method

Method used

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Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0008] Embodiment 1: In this embodiment, a polyimide adhesive is composed of a separately packaged polyimide carrier film and a polyamic acid primer.

[0009] The method of using the polyimide adhesive in this embodiment is as follows: first, apply the polyamic acid primer on the docking side of the object A to be pasted and the object B to be pasted, and then paste the polyimide carrier film on the butt joint of the object A to be pasted or the butt joint of the object B to be pasted, and finally butt, extrude and bond to complete the pasting process.

[0010] The polyimide adhesive in this embodiment has a shear strength of 18MPa-22MPa at room temperature, a shear strength of 10MPa-16MPa at 320°C, a 90° peel strength of 2kN / m-4kN / m, a glass transition temperature greater than 300°C, and a temperature of 5 The % thermal weight loss temperature is greater than 520°C.

[0011] The polyimide adhesive of the present embodiment undergoes thermal aging at 300°C for 160 hours, and ...

specific Embodiment approach 2

[0012] Specific embodiment two: the difference between this embodiment and specific embodiment one is: the polyimide carrier film is a carrier film with a polyimide content of 40% to 60%; the polyamic acid primer It is a thermoplastic polyamic acid solution with a mass concentration of 5% to 10%.

specific Embodiment approach 3

[0013] Specific embodiment three: the difference between this embodiment and specific embodiment two is: the polyimide carrier film is specifically prepared according to the following steps: 1. Preparation of thermosetting polyamic acid: first, 4,4'- Add diaminodiphenyl ether into an aprotic solvent and stir until it is completely dissolved to obtain a transparent solution I. Cool the transparent solution I to 5°C~10°C under ice bath conditions, and then stir at a stirring speed of 50 rpm~ Add 3,3',4,4'-benzophenone tetracarboxylic dianhydride at 200 rpm, and continue to stir for 3h to 5h at a stirring speed of 50rpm to 200rpm to obtain a preliminary reaction solution, then add 4-phenylethynyl phthalic anhydride to the preliminary reaction solution at a stirring speed of 50 rpm to 200 rpm, and continue to stir the reaction at a stirring speed of 50 rpm to 200 rpm 5h~7h, promptly obtain the thermosetting polyamic acid solution that mass concentration is 30%~50%; 3,3 ', 4,4'-ben...

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Abstract

A polyimide adhesive relates to an adhesive and aims at solving problems that the existing polyimide structural adhesive is poor in toughness and decreasing in viscosity and strength is apt to occur in the storing process. The polyimide adhesive is composed of polyimide carrier membranes and polyamide acid primers which are independently packaged. The polyimide adhesive has the advantages that shearing strength at room temperature is 18MPa-22MPa, shearing strength at temperature of 320 DEG C is 10MPa-16MPa, peeling strength at temperature of 90 DEG C is 2kN / m-4kN / m, glass-transition temperature is larger than 300 DEG C, and 5% thermo-gravimetric temperature is larger than 520 DEG C; and bonding strength change is smaller than 5% after thermal ageing at temperature of 300 DEG C after 160 hours, and the polyimide adhesive is suitable for being used as a high temperature structural adhesive. The polyimide adhesive is mainly used for polyimide adhesive preparing.

Description

technical field [0001] The present invention relates to an adhesive. Background technique [0002] Since the advent of polyimide molding compounds in 1964, polyimide has gradually developed into a category due to its excellent thermal oxidation resistance, mechanical properties, dielectric properties, good solvent resistance, and high glass transition temperature. It is a kind of high-temperature resistant material with complete products and various products, which is widely used in the fields of molding resin / parts, magnet wire, film, fiber, prepreg / composite material, coating, adhesive and foam. [0003] In the field of adhesives, as an important material for material connection, it can partially replace traditional welding, riveting or bolting, especially in the connection of components such as composite materials that cannot be welded or riveted at all, and has broad application prospects. The use of polyimide as an adhesive is greatly limited, mainly because the main c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J179/08C08J5/18C08L79/08C08G73/10
Inventor 张斌孙明明张绪刚李坚辉王磊薛刚赵明李奇力
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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