Chip component clamping apparatus and clamping method thereof
A technology for clamping devices and components, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as affecting product yield, unable to provide uniform tension of metal sheet 14, and unable to perform chemical etching on both sides at the same time. , to achieve the effect of improving drainage and improving process quality
Inactive Publication Date: 2014-05-21
运达精密工业股份有限公司
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Problems solved by technology
[0004] However, using such as figure 1 The conventional thin plate clamping device shown cannot perform chemical etching on both sides at the same time. In addition, the method of only using the magnet 20 to attract the metal thin plate 14 cannot provide uniform tension, which will affect the product yield during more precise etching. Therefore, the metal thin plate 14 Surface flatness is also one of the problems to be overcome
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[0043] The technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments to further understand the purpose, solution and effect of the present invention, but it is not intended to limit the scope of protection of the appended claims of the present invention.
[0044] The invention provides a clamping device for chip components, which can generally be used for etching in the fields of semiconductors, display electronics, etc., and the chip components can be made of metal, plastic or other different materials. Figure 2A to Figure 2D It is a schematic diagram of an embodiment of the chip component clamping device of the present invention. Such as Figure 2A and Figure 2B As shown, the chip component clamping device 100 mainly includes a support frame 102 , a first clamping part 210 and a second clamping part 220 . The support frame 102 has a first support arm 104 and a second support arm 10...
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The invention relates to a chip component clamping apparatus and a clamping method thereof. The chip component clamping apparatus comprises a support frame, a first clamping portion, and a second clamping portion, wherein the support frame comprises oppositely arranged first support arm and second support arm and simultaneously provides the support force for the rotation of the first clamping portion and second clamping portion; the first clamping portion comprises a first rotating connecting portion and a first clamping pole which are arranged in paired manner; each end of the first rotating connecting portion is provided with a fixed block arranged between the support frame and the first rotating connecting portion; the second clamping portion comprises a second rotating connecting portion and a second clamping pole which are arranged in a paired manner; each end of the second rotating connecting portion is provided with a slide block arranged between the support frame and the second rotating connecting portion; the first rotating connecting portion can rotate with the first clamping pole in parallel while the second rotating connecting portion can rotate with the second clamping pole in parallel, with the rotating direction opposite to the first clamping portion. The chip component clamping apparatus of the invention is provided with the function of simultaneous etching of double surfaces.
Description
technical field [0001] The present invention relates to a chip component clamping device and its method; specifically, the present invention relates to a chip component clamping device and its method. The chip clamping device has the function of simultaneously etching both sides. Background technique [0002] Thin plate etching is widely used in semiconductor, display electronics and other fields. With the increase in the size of home appliances and the miniaturization of etching, how to improve the precision of etching has become a major issue. The main ways to improve the etching precision are the selection of chemical solutions and the improvement of manufacturing fixtures. [0003] figure 1 It is a schematic diagram of a traditional sheet clamping device. Such as figure 1 As shown, the traditional thin plate clamping method needs to be equipped with a conveyor belt 12 and a magnet 20 to clamp the metal thin plate 14 . When the manufacturing process is in progress, i...
Claims
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IPC IPC(8): H01L21/687
Inventor 涂嘉旭洪苑淑纪怀胜潘昆志朱志宏林仁杰
Owner 运达精密工业股份有限公司