Packaging structure and method for metallic oxide gas sensitive element array

Abstract

The invention discloses a packaging structure and method for a metallic oxide gas sensitive element array. The packaging method comprises the following steps that: a substrate of the metallic oxide gas sensitive element array is obtained by silk-screen printing and is fixed on a metal supporting frame in a buckling manner; the metal supporting frame is fixed on a TO (Transmitter Optical) base or a circuit board in a bonding manner, so that the array substrate is hung; and finally, a signal electrode on the array substrate is connected with an electrode on the TO base or the circuit board, so that signals are led out. The packaging structure for the metallic oxide gas sensitive element array provided by the invention has the advantages of small heat power consumption, simpleness in process and good mechanical stability. Furthermore, a sensor base, a circuit board or other types as a base can be a sensor base or a circuit board or of any type, so that the space is saved, various functional module circuits can be conveniently realized, and the packaging structure has very high market application value.

Description

technical field [0001] The invention belongs to a packaging technology and relates to the field of metal oxide gas sensor arrays, in particular to a package structure of the metal oxide gas sensor array. Background technique [0002] The electronic nose with the array of gas sensor elements as the core is an analytical instrument that simulates the biological sense of smell. Compared with traditional gas analysis instruments, it has the advantages of portability, rapid analysis, simple operation, and low cost. It can be applied to food quality Various odor analysis occasions such as detection and control, environmental monitoring, public safety, medical health and aerospace. Among all the gas sensor types of electronic noses, the metal oxide (MOX) gas sensor has become the largest and most widely used gas sensor in the world because of its high sensitivity and fast response time. The current electronic nose technology is also developing in a more portable and portable direc...

AI Technical Summary

Problems solved by technology

At present, the commonly used gas sensor array packaging structure has disadvantages such as poor mechanical stability and complicated packaging process. For example, the substrate is directly bonded to the base, and the structure has a large heat dissipation, and it is easy to fall off, and the strength is not enough; the structure connected by brazing, The structure is suspended and the process is complicated

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