Thermal treatment apparatus and thermal treatment method

A technology of heat treatment device and heat treatment method, which is applied in the direction of drying gas arrangement, lighting and heating equipment, dryer, etc., can solve the problems of decreased productivity, inability to transfer wafers to wafer boats, and delayed wafer recovery time, etc. To achieve the effect of reducing the impact of heat
CN102637618AActive Publication Date: 2012-08-15TOKYO ELECTRON LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
TOKYO ELECTRON LTD
Publication Date
2012-08-15

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Abstract

The invention provides a thermal treatment apparatus and a thermal treatment method. In the laoding area of an air outlet, with transverse airflow, that is used for generating airflow from a front surface to a rear surface opposite to the front surface, an air outlet channel is arranged between the wafer boat of an unloading position on the lower side of a thermal treatment furnace and the above air outlet. The air outlet channel is equipped with an air vent for thermal exhaust of atmosphere gas that is heated to be of a high temperature due to unloading.
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Description

technical field

[0001] The present invention relates to a heat treatment apparatus that performs predetermined heat treatment by placing a substrate such as a semiconductor wafer on a substrate holder and carrying it into a vertical heat treatment furnace, and that the substrate placed on the substrate unloaded from the vertical heat treatment furnace A technique for rapidly cooling the substrate temperature in the substrate holder. Background technique

[0002] As one type of semiconductor manufacturing apparatus, there is a vertical heat treatment apparatus that heat-treats a plurality of semiconductor wafers (hereinafter referred to as “wafers”) in batches. In this heat treatment apparatus, wafers accommodated in a FOUP (transfer container) are held in layers in a wafer boat, and then the wafer boat is raised and loaded into a heat treatment furnace, whereby a plurality of wafers are processed simultaneously. Carry out the specified heat treatment. Then, the wafer boat ...

Claims

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