Chip cooling device capable of reinforcing boiling heat transfer based on foam metal

Abstract

The invention provides a chip cooling device capable of reinforcing boiling heat transfer based on foam metal, comprising a sealed cavity body, a bottom foam metal, a coolant, a shrinkage pipe, an air injection revolving assembly, a transmission shaft and a fan, wherein the sealed cavity contains the coolant, the bottom foam metal is arranged in the sealed cavity body in a serrated shape and is tightly adhered on the bottom of the sealed cavity body; the shrinkage pipe is arranged in the sealed cavity body and covers the bottom foam metal, one end of the air injection revolving assembly is connected with the top of the shrinkage pipe, the other end of the air injection revolving assembly is connected with the transmission shaft, and the air injection revolving assembly comprises an air cavity and a plurality of air injection pipes, the air cavity is communicated with the shrinkage pipe and the plurality of air injection pipes, and the plurality of the air injection pipes have nozzles with consistent directions; and the transmission shaft is connected with the fan. The chip cooling device disclosed by the invention reinforces boiling by utilizing a serrated foam metal structure so that the heat dissipating capacity is remarkably enlarged, power is provided for an outer air-cooling fan by utilizing boiling steam and the cooling capability is greatly reinforced.

Description

technical field [0001] The invention relates to a chip cooling device, in particular to a chip cooling device based on foam metal enhanced boiling heat transfer. Background technique [0002] With the development of electronic technology, the performance of electronic chips has improved rapidly, and the heat generation power has also increased sharply. At present, the maximum heating power of ordinary chips exceeds 100W, and the average heat dissipation heat flux density between the chip shell and the cooling device can reach 7.1W / cm 2 Above, and still growing, this puts forward high requirements on the heat dissipation capacity of the chip cooling device. Boiling heat transfer is an efficient phase-change heat transfer method, and its heat transfer coefficient is 1 to 2 orders of magnitude higher than that of single-phase heat transfer. Metal foam is a kind of high porosity (up to 98%), high specific surface area (500 ~ 10000m 2 / m 3 ) of porous media can enhance boilin...

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Problems solved by technology

[0004] Although the structures in the above patents have improved the heat dissipation effect of the chip cooling device, there are still deficiencies: 1) in these patents, fans are arranged outside the condensation surface, and the fans force air convection to strengthen heat exchange, but the fans are all Electric drive requires additional power input from the outside, which increases the energy consumption of the device and increases the operating cost. On the other hand, it also requires external wires, which makes the structure of the device not compact enough.

2) In the above-mentioned patents, metal foam is processed into a flat plate shape. Although the boiling heat transfer is generally enhanced, existing research results have shown that metal foam fibers will hinder the growth of bubbles during the boiling process, thereby affecting the effect of enhanced boiling, making the foam The potential of metal enhanced boiling heat transfer has not been fully realized

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