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Back plate system

A backplane and power backplane technology, applied in the field of communication, can solve the problems of system power supply and heat dissipation, and achieve the effects of reducing the number of layers and PCB space, stabilizing the system, and improving heat dissipation

Active Publication Date: 2012-08-22
XFUSION DIGITAL TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, in order to achieve high-density service capabilities for existing frame-type electrical equipment such as blade servers, switches, and routers, the system power is continuously increased, which makes it difficult to implement power supply and heat dissipation for the system.

Method used

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Embodiment Construction

[0017] The technical solutions of the present invention will be described in further detail below with reference to the accompanying drawings and embodiments.

[0018] The present invention adopts a three-dimensional combined backplane design scheme, which increases the opening area of ​​the central backplane and improves the heat dissipation capacity of the system.

[0019] Figure 2A is a schematic diagram of the three-dimensional structure of the backplane system of the embodiment of the present invention, Figure 2B is a cross-sectional view of the backplane system of the present invention. Such as Figure 2A and 2B As shown, the backplane system includes: a power module 201 , a service board 202 , a power backplane 203 and a signal backplane 204 .

[0020] One or more service boards 202 are set on one side of the signal backplane 204 for integrating services and completing service processing. The signal backplane 204 is used for signal interconnection between service...

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Abstract

The invention relates to a back plate system. The back plate system comprises one or more service plate cards, a power supply module, a signal back plate and a power supply back plate, wherein the service plate cards are arranged on one side of the signal back plate and used for processing services; the signal back plate is used for signal interconnection between the service plate cards or signal interconnection between the service plate cards and other modules; the power supply module is arranged on the other side of the signal back plate and used for connecting with the service plate cards through the power supply back plate and supplying power to the service plate cards through the power supply back plate; a ventilation area is formed between the power supply back plate and the signal back plate or ventilation holes are formed in the signal back plate; the ventilation area and the ventilation holes are used for forming an air channel from one side to the other side of the signal back plate so as to cool the system; the plane on which the power supply back plate is arranged is parallel to the ventilation direction of the air channel; and the signal back plate is vertical to the plane on which the power supply back plate is arranged, and is vertical to the ventilation direction of the air channel.

Description

technical field [0001] The invention relates to the communication field, in particular to a backplane system. Background technique [0002] In the field of IT servers, with the continuous improvement of semiconductor integration and business requirements, the power consumption of a single system is getting higher and higher. Taking the blade server as an example, the power consumption of a single 10U device has reached 7200W, and is evolving to 10000W. System power supply and heat dissipation capabilities have gradually become one of the key bottlenecks in system design. How to solve the contradiction between the power increase that comes with system performance improvement and the increasing difficulty of system heat dissipation and power supply design has become a technical problem that various equipment manufacturers need to constantly overcome. [0003] Figure 1A It is a three-dimensional structural schematic diagram of an existing backplane communication system, Fig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/16G06F1/26G06F1/20
CPCG06F1/189G06F1/20
Inventor 张小华吴志欢熊星
Owner XFUSION DIGITAL TECH CO LTD
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