Heat-conduction base plate of LED (Light-Emitting Diode) display and manufacturing method thereof

Abstract

The invention relates to a heat-conduction base plate of an LED (Light-Emitting Diode) display, belonging to the technical field of LED display. The heat-conduction base plate is placed between an LED lamp board and a back board of the LED display, and is formed by compositing a metal board layer and a heat-conduction plastic layer. When the metal board layer and the back board are opposite, the heat-conduction plastic layer and the LED lamp board are opposite, and the surface of the heat-conduction plastic layer is arc-shaped. The invention further relates to a manufacturing method of the heat-conduction base plate of the LED display, comprising the following steps of: step 1, manufacturing an aluminum alloy raw material to be a metal board layer through a die-casting forming technique; step 2, drying a heat conduction plastic raw material; and step 3, placing the pre-heated metal board layer obtained in the step 1 into an injection mold, and then forming the heat-conduction plastic layer with the arc-shaped surface on the metal board layer by injecting the heat-conduction plastic raw material obtained by the step 2 in the injection mold. With the adoption of the manufacturing method of the heat-conduction base plate of the LED display provided by the invention, heat radiation effects of an LED chip in a display screen can be effectively improved; the light intensity, the density and the service life of the LED display can be improved, and the spherical appearance of the LED display is realized.

Description

Technical field [0001] The invention relates to the technical field of LED display, in particular to a heat conducting pad for an LED display screen and a manufacturing method thereof. Background technique [0002] In the existing LED display screen, the LED chip is the main heat source. If the heat cannot be dissipated in time when the LED chip is working, the temperature of the LED chip will be too high, which will lead to the reduction of the light efficiency of the LED and shorten the life of the LED, which will directly affect As far as the brightness, density and service life of the LED display are concerned, how to dissipate the heat generated by the LED chip in time has become a design focus of the LED display. [0003] Current LED display screens mostly use natural heat dissipation or flat substrate heat dissipation. The natural heat dissipation method does not use auxiliary heat dissipation components. The LED chip is directly mounted on the lamp board, and the heat diss...

AI Technical Summary

Problems solved by technology

Natural heat dissipation does not use auxiliary heat dissipation components, and the LED chip is directly installed on the light board, which has a poor heat dissipation effect; and the LED display with a flat substrate is not suitable for a spherical or curved LED display. Because the LED light board is directly installed on the flat substrate, the LED display module is also in the shape of a plane, so that the curved surface or the ball screen can only be a polyhedron composed of flat-shaped LED display modules, so that the ball screen and the arc The surface is not "smooth", the appearance of the resulting LED display is not beautiful, it cannot truly realize multi-angle viewing, and the text and patterns lack coherence

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